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Patent applications and USPTO patent grants for Li; Si Yi.The latest application filed is for "plasma etching of silicon carbide".
Patent | Date |
---|---|
Method of plasma etching low-k dielectric materials Grant 7,311,852 - Li , et al. December 25, 2 | 2007-12-25 |
Plasma etching of silicon carbide Grant 7,166,535 - Li , et al. January 23, 2 | 2007-01-23 |
Method for etching silicon carbide Grant 6,919,278 - Kang , et al. July 19, 2 | 2005-07-19 |
Method for patterning multilevel interconnects Grant 6,875,699 - Lassig , et al. April 5, 2 | 2005-04-05 |
Method of plasma etching of silicon carbide Grant 6,670,278 - Li , et al. December 30, 2 | 2003-12-30 |
Plasma etching of silicon carbide App 20030199170 - Li, Si Yi | 2003-10-23 |
Method for etching silicon carbide App 20030087531 - Kang, Sean S. ;   et al. | 2003-05-08 |
Method of plasma etching low-k dielectric materials App 20030024902 - Li, Si Yi ;   et al. | 2003-02-06 |
Plasma etching of silicon carbide App 20020177321 - Li, Si Yi | 2002-11-28 |
Method of plasma etching of silicon carbide App 20020177322 - Li, Si Yi ;   et al. | 2002-11-28 |
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