LI; Shu-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for LI; Shu-Wei.The latest application filed is for "graded metallic liner for metal interconnect structures and methods for forming the same".
- LI; Shu-Wei - Hsinchu TW
- LI; Shu-Wei - Hsin-chu TW
| Patent | Date |
|---|---|
| Graded Metallic Liner For Metal Interconnect Structures And Methods For Forming The Same App 20220302039 - LI; Shu-Wei ; et al. | 2022-09-22 |
| Semiconductor Device Structure And Methods Of Forming The Same App 20220270970 - CHAN; Yu-Chen ; et al. | 2022-08-25 |
| Two 2d Capping Layers On Interconnect Conductive Structure To Increase Interconnect Structure Reliability App 20220157710 - Li; Shu-Wei ; et al. | 2022-05-19 |
| Semiconductor Structure And Method For Forming The Same App 20220068799 - LU; MENG-PEI ; et al. | 2022-03-03 |
| Organic Fluorescent Luminescent Material And Organic Electroluminescent Device App 20170170419 - HU; Hung-Chieh ; et al. | 2017-06-15 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 