Li; Shoutian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Shoutian.The latest application filed is for "polishing composition and method utilizing abrasive particles treated with an aminosilane".

Company Profile

2.20.16

Li; Shoutian - Naperville IL
Li, Shoutian - Midlothian VA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing composition and method utilizing abrasive particles treated with an aminosilane Grant 11,034,862 - Grumbine , et al. June 15, 2	2021-06-15
Polishing Composition And Method Utilizing Abrasive Particles Treated With An Aminosilane App 20200056069 - Grumbine; Steven ; et al.	2020-02-20
Polishing composition and method utilizing abrasive particles treated with an aminosilane Grant 10,508,219 - Grumbine , et al. Dec	2019-12-17
CMP porous pad with particles in a polymeric matrix Grant 9,951,054 - Li , et al. April 24, 2	2018-04-24
Polishing composition and method utilizing abrasive particles treated with an aminosilane Grant 9,617,450 - Grumbine , et al. April 11, 2	2017-04-11
Polishing Composition And Method Utilizing Abrasive Particles Treated With An Aminosilane App 20170051181 - GRUMBINE; Steven ; et al.	2017-02-23
Polishing composition and method utilizing abrasive particles treated with an aminosilane Grant 9,028,572 - Grumbine , et al. May 12, 2	2015-05-12
Metal cations for initiating polishing Grant 8,637,404 - Carter , et al. January 28, 2	2014-01-28
Halide anions for metal removal rate control Grant 8,591,763 - Li November 26, 2	2013-11-26
Iodate-containing chemical-mechanical polishing compositions and methods Grant 8,551,202 - Li , et al. October 8, 2	2013-10-08
Compositions for CMP of semiconductor materials Grant 8,529,680 - De Rege Thesauro , et al. September 10, 2	2013-09-10
Barrier slurry for low-k dielectrics Grant 8,252,687 - Li , et al. August 28, 2	2012-08-28
Tantalum CMP compositions and methods Grant 7,998,228 - Li August 16, 2	2011-08-16
Metal Cations For Initiating Polishing App 20110065364 - CARTER; Phillip W. ; et al.	2011-03-17
Compositions For Cmp Of Semiconductor Materials App 20100314576 - THESAURO; Francesco DE REGE ; et al.	2010-12-16
Cmp Porous Pad With Particles In A Polymeric Matrix App 20100273399 - Li; Shoutian ; et al.	2010-10-28
Halide anions for metal removal rate control Grant 7,820,067 - Li October 26, 2	2010-10-26
Compositions and methods for CMP of semiconductor materials Grant 7,803,203 - De Rege Thesauro , et al. September 28, 2	2010-09-28
Barrier slurry for low-k dielectrics App 20100075502 - Li; Shoutian ; et al.	2010-03-25
Compositions And Methods For Ruthenium And Tantalum Barrier Cmp App 20090124173 - Li; Shoutian	2009-05-14
Polishing Composition And Method Utilizing Abrasive Particles Treated With An Aminosilane App 20090081927 - Grumbine; Steven ; et al.	2009-03-26
Halide Anions For Metal Removal Rate Control App 20080096390 - Li; Shoutian	2008-04-24
Tantalum CMP compositions and methods App 20080016784 - Li; Shoutian	2008-01-24
CMP method for copper-containing substrates App 20070249167 - Zhang; Jian ; et al.	2007-10-25
Iodate-containing chemical-mechanical polishing compositions and methods App 20070224919 - Li; Shoutian ; et al.	2007-09-27
Halide anions for metal removal rate control App 20070224822 - Li; Shoutian	2007-09-27
Compositions And Methods For Cmp Of Semiconductor Materials App 20070181535 - De Rege Thesauro; Francesco ; et al.	2007-08-09
Metal cations for initiating polishing App 20070068087 - Carter; Phillip W. ; et al.	2007-03-29
Alkyl-substituted aryl polyalkoxylates and their use in fuels App 20030131527 - Colucci, William J. ; et al.	2003-07-17
(Meth) acrylate copolymer pour point depressants Grant 6,255,261 - Liesen , et al. July 3, 2	2001-07-03

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