Li; Ming Hsun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Ming Hsun.The latest application filed is for "semiconductor packaging substrate improving capability of electrostatic dissipation".

Company Profile

0.4.5

Li; Ming Hsun - Tainan County TW
Li; Ming-Hsun - Tainan TW
Li; Ming-Hsun - Chiayi City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packaging substrate improving capability of electrostatic dissipation Grant 8,253,235 - Chen , et al. August 28, 2	2012-08-28
Film type package for fingerprint sensor Grant 7,936,032 - Huang , et al. May 3, 2	2011-05-03
Film type package for fingerprint sensor Grant 7,812,422 - Huang , et al. October 12, 2	2010-10-12
Semiconductor Packaging Substrate Improving Capability Of Electrostatic Dissipation App 20100207268 - CHEN; TSUNG LUNG ; et al.	2010-08-19
Semiconductor packaging substrate improving capability of electrostatic dissipation Grant 7,732,911 - Chen , et al. June 8, 2	2010-06-08
Flim type package for fingerprint sensor App 20080187191 - Huang; Ming-Liang ; et al.	2008-08-07
Semiconductor packaging substrate improving capability of electrostatic dissipation App 20080157337 - Chen; Tsung-Lung ; et al.	2008-07-03
Flim type package for fingerprint sensor App 20080085038 - Huang; Ming-Liang ; et al.	2008-04-10
Flexible substrate capable of preventing lead thereon from fracturing App 20070040262 - Huang; Min-O ; et al.	2007-02-22

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