LI; Linping
Patent Applications and Registrations
Patent applications and USPTO patent grants for LI; Linping.The latest application filed is for "chip packaging method and chip packaging structure".
- LI; Linping - Hangzhou CN
- Li; Linping - Zhejiang CN
- LI; LINPING - Hangzhou City CN
| Patent | Date |
|---|---|
| Chip Packaging Method And Chip Packaging Structure App 20220181269 - LI; Linping ; et al. | 2022-06-09 |
| Method for packaging a chip Grant 11,177,141 - Li November 16, 2 | 2021-11-16 |
| Chip packaging method and chip packaging structure Grant 10,985,120 - Li , et al. April 20, 2 | 2021-04-20 |
| Chip Packaging Method And Chip Packaging Structure App 20210111135 - LI; Linping ; et al. | 2021-04-15 |
| Method For Packaging A Chip And A Chip Package Structure Thereof App 20200343109 - LI; LINPING | 2020-10-29 |
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