Li; Ling-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Ling-Wei.The latest application filed is for "chip package structure with ring-like structure".
- Li; Ling-Wei - Hsinchu TW
- LI; Ling-Wei - Hsinchu City TW
- - Hsinchu City TW
- Li; Ling-Wei - Taipei TW
| Patent | Date |
|---|---|
| Chip package structure Grant 11,456,276 - Li , et al. September 27, 2 | 2022-09-27 |
| Bump layout for coplanarity improvement Grant 11,211,318 - Li , et al. December 28, 2 | 2021-12-28 |
| Chip Package Structure With Ring-like Structure App 20210375821 - YANG; Sheng-Yao ; et al. | 2021-12-02 |
| Chip package structure including ring-like structure and method for forming the same Grant 11,088,108 - Yang , et al. August 10, 2 | 2021-08-10 |
| Structure And Formation Method Of Chip Package With Fan-out Feature App 20210066125A1 - | 2021-03-04 |
| Structure And Formation Method Of Chip Package With Through Vias App 20210066179A1 - | 2021-03-04 |
| Chip Package Structure And Method For Forming The Same App 20200411467 - YANG; Sheng-Yao ; et al. | 2020-12-31 |
| Chip Package Structure App 20200411468 - LI; Ling-Wei ; et al. | 2020-12-31 |
| Purine compounds possessing anticancer activity Grant 10,765,681 - Wong , et al. Sep | 2020-09-08 |
| Chip package structure and method for forming the same Grant 10,770,427 - Li , et al. Sep | 2020-09-08 |
| Bump Layout For Coplanarity Improvement App 20200105654 - Li; Ling-Wei ; et al. | 2020-04-02 |
| Purine Compounds Possessing Anticancer Activity App 20180369249 - Wong; Chi-Huey ; et al. | 2018-12-27 |
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