LI; Kuo-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for LI; Kuo-Wei.The latest application filed is for "package structure having solder mask layer with low dielectric constant and method of fabricating the same".

Company Profile

0.4.8

LI; Kuo-Wei - Taipei City TW
Li; Kuo-Wei - Taipei TW
Li; Kuo-Wei - Taoyuan TW
LI; Kuo-Wei - Taoyuan City TW
Li; Kuo-Wei - Pingzhen TW
LI; Kuo-Wei - Pingzhen City TW
Li; Kuo-Wei - Hsinchu TW
Li; Kuo-Wei - Hsin-Chu TW
Li; Kuo-Wei - Miaoli TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Structure Having Solder Mask Layer With Low Dielectric Constant And Method Of Fabricating The Same App 20220240367 - WU; Ming-Hao ; et al.	2022-07-28
Method of manufacturing circuit board structure Grant 11,114,782 - Tseng , et al. September 7, 2	2021-09-07
Circuit Board Structure And Manufacturing Method Thereof App 20210273356 - TSENG; Tzyy-Jang ; et al.	2021-09-02
Circuit Board Structure And Manufacturing Method Thereof App 20200366012 - TSENG; Tzyy-Jang ; et al.	2020-11-19
Polyimide polymer, polyimide film having the same and polyimide laminate having the same Grant 9,499,664 - Sun , et al. November 22, 2	2016-11-22
Polyimide Polymer, Polyimide Film Having The Same And Polyimide Laminate Having The Same App 20160122483 - SUN; Der-Jen ; et al.	2016-05-05
Manufacturing Method Of Multilayer Flexible Circuit Structure App 20160073505 - Yu; Cheng-Po ; et al.	2016-03-10
Polyimide film and polyimide laminate thereof Grant 9,234,085 - Sun , et al. January 12, 2	2016-01-12
Polyimide Film And Polyimide Laminate Thereof App 20140205824 - SUN; Der-Jen ; et al.	2014-07-24
Colors only process to reduce package yield loss Grant 7,816,169 - Fan , et al. October 19, 2	2010-10-19
Handle Mechanism App 20090133227 - Yang; Chih-Chung ; et al.	2009-05-28
Polyimide based flexible copper clad laminates and method of producing the same App 20070044910 - Kuo; Pei-Rong ; et al.	2007-03-01

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