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name:-0.0072801113128662
name:-0.00045084953308105
LI; KUAN-HSING Patent Filings

LI; KUAN-HSING

Patent Applications and Registrations

Patent applications and USPTO patent grants for LI; KUAN-HSING.The latest application filed is for "printed circuit board transmission line utilized as millimeter wave attenuator".

Company Profile
0.5.15
  • LI; KUAN-HSING - SHANGHAI CN
  • LI; Kuan-Hsing - Taichung City TW
  • Li; Kuan-Hsing - Taichung TW
  • Li; Kuan-Hsing - Nan-Tou TW
  • Li; Kuan-Hsing - Tsao Tuen TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Printed Circuit Board Transmission Line Utilized As Millimeter Wave Attenuator
App 20220209383 - LI; KUAN-HSING
2022-06-30
Device And Method Of Detecting Signal Delay
App 20160146883 - LI; Kuan-Hsing
2016-05-26
Conformal Shielding Module
App 20140001471 - LI; Kuan-Hsing
2014-01-02
Wireless communication module
Grant 8,144,479 - Liao , et al. March 27, 2
2012-03-27
Multi-cavity electromagnetic shielding device
Grant 8,059,416 - Li , et al. November 15, 2
2011-11-15
Metallic cover of miniaturization module
Grant 7,787,250 - Li , et al. August 31, 2
2010-08-31
Test method and device for land grid array components
App 20090284266 - Li; Kuan-Hsing
2009-11-19
Multi-cavity Electromagnetic Shielding Device
App 20090244876 - Li; Kuan-Hsing ;   et al.
2009-10-01
Electromagnetic Shielding Device
App 20090231825 - LI; Kuan-Hsing ;   et al.
2009-09-17
Metallic cover of miniaturization module
App 20090166830 - Li; Kuan-Hsing ;   et al.
2009-07-02
Wireless communication module
Grant 7,554,189 - Li , et al. June 30, 2
2009-06-30
Method of manufacturing pins of miniaturization chip module
App 20090162976 - Li; Kuan-Hsing ;   et al.
2009-06-25
Wireless communication module
App 20090161334 - Liao; Kuo-Hsien ;   et al.
2009-06-25
Wireless Communication Nodule Assembly
App 20080291654 - Liao; Kuo-Hsien ;   et al.
2008-11-27
Small-sized Communication Module Package
App 20080291637 - Li; Kuan-Hsing ;   et al.
2008-11-27
Communication Module Package Assembly
App 20080291639 - Li; Kuan-Hsing ;   et al.
2008-11-27
Communications Module
App 20080207016 - Li; Kuan-Hsing ;   et al.
2008-08-28
Planar inverted-F antenna
Grant 7,106,259 - Tseng , et al. September 12, 2
2006-09-12
Planar inverted-F antenna
App 20060038722 - Tseng; Kuo-Hua ;   et al.
2006-02-23

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