Li; Jian-Jhih
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Jian-Jhih.The latest application filed is for "wafer formed by slicing an ingot".
- Li; Jian-Jhih - Hsinchu TW
- LI; JIAN-JHIH - HSINCHU CITY TW
- Li; Jian-Jhih - Tainan County TW
| Patent | Date |
|---|---|
| Wafer formed by slicing an ingot Grant 9,490,326 - Li , et al. November 8, 2 | 2016-11-08 |
| Wafer Formed By Slicing An Ingot App 20150236096 - LI; JIAN-JHIH ; et al. | 2015-08-20 |
| Nanostructuring process for ingot surface, water manufacturing method, and wafer using the same Grant 9,051,664 - Chyan , et al. June 9, 2 | 2015-06-09 |
| Nanostructuring Process For Ingot Surface, Wafer Manufacturing Method, And Wafer Using The Same App 20120193764 - CHYAN; Jiunn-Yih ; et al. | 2012-08-02 |
| Apparatus For Controlling Movement Of A Lamp Unit Relative To An Automobile Body App 20110122641 - Wang; Yu-Chieh ; et al. | 2011-05-26 |
| Apparatus For Controlling Movement Of A Lamp Unit Relative To An Automobile Body App 20110122640 - Wang; Yu-Chieh ; et al. | 2011-05-26 |
| Apparatus For Controlling Movement Of A Lamp Unit Relative To An Automobile Body App 20110113903 - Wang; Yu-Chieh ; et al. | 2011-05-19 |
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