Li; Jerry
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Jerry.The latest application filed is for "pillared cavity down mis-sip".
- Li; Jerry - Taichung City TW
- Li; Jerry - Taichung TW
- Li; Jerry - Hangzhou CN
- Li, Jerry - Taoyuan TW
| Patent | Date |
|---|---|
| Pillared Cavity Down MIS-SIP App 20210305167 - Gutierrez, III; Ernesto ; et al. | 2021-09-30 |
| Wafer level chip scale package structure Grant 11,114,359 - Belonio, Jr. , et al. September 7, 2 | 2021-09-07 |
| Pillared cavity down MIS-SIP Grant 11,075,167 - Gutierrez, III , et al. July 27, 2 | 2021-07-27 |
| Dual-fuel integrated switch Grant 11,008,958 - Tang , et al. May 18, 2 | 2021-05-18 |
| Pillared Cavity Down MIS-SIP App 20200251350 - Kind Code | 2020-08-06 |
| Integrated circuit package and a method for forming a wafer level chip scale package (WLCSP) with through mold via (TMV) Grant 10,727,174 - Belonio, Jr. , et al. | 2020-07-28 |
| Wafer Level Chip Scale Package Structure App 20200091026 - Belonio, JR.; Jesus Mennen ; et al. | 2020-03-19 |
| Integrated Circuit Package and a method for Forming a Wafer Level Chip Scale Package (WLCSP) with Through Mold Via (TMV) App 20200091051 - Belonio, JR.; Jesus Mennen ; et al. | 2020-03-19 |
| Container for blank optical disks App 20030192793 - Li, Jerry ; et al. | 2003-10-16 |
| SEC | 0001615439 | Li Jerry |
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