Li; Jeng-Jen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Jeng-Jen.The latest application filed is for "package structure and the method to fabricate thereof".
- Li; Jeng-Jen - Taipei TW
- Li; Jeng-Jen - Tai Pei N/A TW
- LI; JENG-JEN - Taipei City TW
- Li; Jeng-Jen - US
| Patent | Date |
|---|---|
| Package structure and the method to fabricate thereof Grant 10,636,735 - Lu , et al. | 2020-04-28 |
| Package structure and the method to fabricate thereof Grant 10,373,894 - Lu , et al. | 2019-08-06 |
| Package structure and the method to fabricate thereof Grant 10,373,930 - Li , et al. | 2019-08-06 |
| Package Structure And The Method To Fabricate Thereof App 20170047273 - LU; BAU-RU ; et al. | 2017-02-16 |
| Package structure and the method to fabricate thereof Grant 9,536,798 - Lu , et al. January 3, 2 | 2017-01-03 |
| Electronic system with a composite substrate Grant 9,484,290 - Lee , et al. November 1, 2 | 2016-11-01 |
| Metal core printed circuit board and electronic package structure Grant 9,386,686 - Huang , et al. July 5, 2 | 2016-07-05 |
| Package Structure And The Method To Fabricate Thereof App 20140042610 - LI; JENG-JEN ; et al. | 2014-02-13 |
| Electronic package structure Grant 8,619,428 - Lee , et al. December 31, 2 | 2013-12-31 |
| Electronic System With A Composite Substrate App 20130328181 - Lee; Han-Hsiang ; et al. | 2013-12-12 |
| Electronic system with a composite substrate Grant 8,547,709 - Lee , et al. October 1, 2 | 2013-10-01 |
| Package Structure And The Method To Fabricate Thereof App 20130213704 - LU; BAU-RU ; et al. | 2013-08-22 |
| Package Structure And The Method To Fabricate Thereof App 20130093069 - LU; BAU-RU ; et al. | 2013-04-18 |
| Metal Core Printed Circuit Board And Electronic Package Structure App 20120268896 - HUANG; Chi-Feng ; et al. | 2012-10-25 |
| Driving Circuit Of Light Emitting Diodes Having At Least One Bypass Circuit, And Driving Method Thereof App 20120262074 - Wang; Wei-Cheng ; et al. | 2012-10-18 |
| Electronic element packaging module Grant 8,253,041 - Chen , et al. August 28, 2 | 2012-08-28 |
| Electronic Package Structure App 20120075808 - LEE; Han-Hsiang ; et al. | 2012-03-29 |
| Electronic System With A Composite Substrate App 20110199746 - LEE; Han-Hsiang ; et al. | 2011-08-18 |
| Electronic Element Packaging Module App 20100309638 - Chen; Da-Jung ; et al. | 2010-12-09 |
| Power module package structure Grant 7,405,467 - Liu , et al. July 29, 2 | 2008-07-29 |
| Method for preventing the overflowing of molding compound during fabricating package device App 20060284340 - Liu; Chun-Tiao ; et al. | 2006-12-21 |
| Power module package structure App 20060267187 - Liu; Chun-Tiao ; et al. | 2006-11-30 |
| Package structure having mixed circuit and composite substrate App 20060220188 - Liu; Chun-Tiao ; et al. | 2006-10-05 |
| Packaging method for organic polymer EL displays Grant 6,383,048 - Yang , et al. May 7, 2 | 2002-05-07 |
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