Li; Hung-Chi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Hung-Chi.The latest application filed is for "semiconductor structure".
- Li; Hung-Chi - Taipei TW
- LI; HUNG-CHI - TAIPEI CITY TW
| Patent | Date |
|---|---|
| Package structure Grant 11,282,766 - Ku , et al. March 22, 2 | 2022-03-22 |
| Semiconductor Structure App 20210366805 - WU; CHI-HSI ; et al. | 2021-11-25 |
| Heat Spreading Device and Method App 20210280491 - Lin; Tsung-Shu ; et al. | 2021-09-09 |
| Semiconductor structure Grant 11,088,048 - Wu , et al. August 10, 2 | 2021-08-10 |
| Semiconductor Device and Method of Manufacture App 20210233833 - Ku; Shih-Chang ; et al. | 2021-07-29 |
| Heat spreading device and method Grant 11,018,073 - Lin , et al. May 25, 2 | 2021-05-25 |
| Semiconductor device methods of manufacture Grant 10,978,373 - Ku , et al. April 13, 2 | 2021-04-13 |
| Package Structure App 20210098333 - Ku; Shih-Chang ; et al. | 2021-04-01 |
| Multi-terminal inductor for integrated circuit Grant 10,879,342 - Hsu , et al. December 29, 2 | 2020-12-29 |
| Multi-terminal Inductor For Integrated Circuit App 20200286981 - Hsu; Ching-Chung ; et al. | 2020-09-10 |
| Multi-terminal inductor for integrated circuit Grant 10,672,860 - Hsu , et al. | 2020-06-02 |
| Semiconductor Structure App 20200135610 - WU; CHI-HSI ; et al. | 2020-04-30 |
| Multi-terminal Inductor For Integrated Circuit App 20200066831 - Hsu; Ching-Chung ; et al. | 2020-02-27 |
| Heat Spreading Device And Method App 20200051888 - Lin; Tsung-Shu ; et al. | 2020-02-13 |
| Semiconductor structure and manufacturing method thereof Grant 10,515,867 - Wu , et al. Dec | 2019-12-24 |
| Semiconductor Device And Method Of Manufacture App 20190385929 - Ku; Shih-Chang ; et al. | 2019-12-19 |
| Multi-terminal inductor for integrated circuit Grant 10,475,877 - Hsu , et al. Nov | 2019-11-12 |
| Heat spreading device and method Grant 10,461,014 - Lin , et al. Oc | 2019-10-29 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190148261 - WU; CHI-HSI ; et al. | 2019-05-16 |
| Heat Spreading Device and Method App 20190067157 - Lin; Tsung-Shu ; et al. | 2019-02-28 |
| Semiconductor structure and manufacturing method thereof Grant 10,153,218 - Chen , et al. Dec | 2018-12-11 |
| Semiconductor Structure And Manufacturing Method Thereof App 20180151472 - CHEN; TSUNG-YU ; et al. | 2018-05-31 |
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