Li; Hsun-Tien

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Hsun-Tien.The latest application filed is for "organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same".

Company Profile

0.11.13

Li; Hsun-Tien - Hsinchu TW
Li; Hsun-Tien - Hsinchu City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same Grant 9,617,411 - Chan , et al. April 11, 2	2017-04-11
Organic-inorganic Hybrid Resin, Molding Composition, And Photoelectric Device Employing The Same App 20150197631 - CHAN; Ying-Nan ; et al.	2015-07-16
Organic-inorganic metal oxide hybrid resin, a method for forming the same, and transparent resin composition formed therefrom Grant 8,721,919 - Huang , et al. May 13, 2	2014-05-13
Organic-inorganic Metal Oxide Hybrid Resin, A Method For Forming The Same, And Transparent Resin Composition Formed Therefrom App 20130334458 - HUANG; Shu-Chen ; et al.	2013-12-19
Transparent silicone epoxy composition Grant 8,440,774 - Lin , et al. May 14, 2	2013-05-14
Transparent Silicone Epoxy Composition App 20120172505 - Lin; Chich-Haw ; et al.	2012-07-05
Encapsulant composition for a light-emitting diode Grant 8,013,039 - Hsu , et al. September 6, 2	2011-09-06
Encapsulant Composition For A Light-emitting Diode App 20090093570 - Hsu; Chia-Wen ; et al.	2009-04-09
Chip package structure and process for fabricating the same Grant 7,230,331 - Chen , et al. June 12, 2	2007-06-12
Process For Fabricating Chip Package Structure App 20070072339 - Chen; Kai-Chi ; et al.	2007-03-29
Chip Package Structure App 20060261499 - Chen; Kai-Chi ; et al.	2006-11-23
Chip package structure Grant 7,061,103 - Chen , et al. June 13, 2	2006-06-13
Chip package structure Grant 7,057,277 - Chen , et al. June 6, 2	2006-06-06
Chip package structure and process for fabricating the same App 20050087852 - Chen, Kai-Chi ; et al.	2005-04-28
Fine conductive particles for making anisotropic conductive adhesive composition Grant 6,841,094 - Li , et al. January 11, 2	2005-01-11
Method of assembling a semiconductor device including sweeping (with a squeegee) encapsulant over the device repeatedly Grant 6,821,818 - Chen , et al. November 23, 2	2004-11-23
[chip Package Structure] App 20040212970 - Chen, Kai-Chi ; et al.	2004-10-28
[chip Package Structure] App 20040212056 - Chen, Kai-Chi ; et al.	2004-10-28
[chip Package Structure And Process For Fabricating The Same] App 20040212080 - Chen, Kai-Chi ; et al.	2004-10-28
Method Of Assembling A Semiconductor Device Including Sweeping (with A Squeegee) Encapsulant Over The Device Repeatedly App 20040180472 - Chen, Kai-Chi ; et al.	2004-09-16
Fine conductive particles for making anisotropic conductive adhesive composition App 20040056236 - Li, Hsun-Tien ; et al.	2004-03-25
Dielectric compositions having two steps of laminating temperatures Grant 6,627,684 - Lee , et al. September 30, 2	2003-09-30
Dielectric compositions having two steps of laminating temperatures App 20020123540 - Lee, Tzong-Ming ; et al.	2002-09-05

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