| Patent | Date |
|---|
On-pitch vias for semiconductor devices and associated devices and systems
Grant 11,437,435 - Li , et al. September 6, 2 | 2022-09-06 |
Devices Including Floating Vias
App 20220271052 - Li; Hongqi ; et al. | 2022-08-25 |
Slit oxide and via formation techniques
Grant 11,367,681 - Li , et al. June 21, 2 | 2022-06-21 |
Devices including floating vias and related systems and methods
Grant 11,355,508 - Li , et al. June 7, 2 | 2022-06-07 |
Devices Including Floating Vias And Related Systems And Methods
App 20220052061 - Li; Hongqi ; et al. | 2022-02-17 |
On-pitch Vias For Semiconductor Devices And Associated Devices And Systems
App 20220037400 - Li; Hongqi ; et al. | 2022-02-03 |
Slit Oxide And Via Formation Techniques
App 20220020685 - Li; Hongqi ; et al. | 2022-01-20 |
Traction device and traction method
Grant 11,203,239 - Sun , et al. December 21, 2 | 2021-12-21 |
Fork-arm lift tractor
Grant 11,104,309 - He , et al. August 31, 2 | 2021-08-31 |
Methods Of Exposing Conductive Vias Of Semiconductor Devices And Related Semiconductor Devices
App 20210183697 - Li; Hongqi ; et al. | 2021-06-17 |
Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines
App 20210167132 - Wei; Lei ; et al. | 2021-06-03 |
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Grant 11,011,420 - Li , et al. May 18, 2 | 2021-05-18 |
Fabrication Of Electrodes For Memory Cells
App 20210098697 - Zheng; Pengyuan ; et al. | 2021-04-01 |
Multitier arrangements of integrated devices, and methods of forming sense/access lines
Grant 10,957,741 - Wei , et al. March 23, 2 | 2021-03-23 |
Interconnect assemblies with through-silicon vias and stress-relief features
Grant 10,847,442 - Li , et al. November 24, 2 | 2020-11-24 |
Multitier Arrangements of Integrated Devices, and Methods of Forming Sense/Access Lines
App 20200350370 - Wei; Lei ; et al. | 2020-11-05 |
Fabrication of electrodes for memory cells
Grant 10,825,987 - Zheng , et al. November 3, 2 | 2020-11-03 |
Slit Oxide And Via Formation Techniques
App 20200243440 - Li; Hongqi ; et al. | 2020-07-30 |
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials And Associated Systems, Devices, And Metho
App 20200235007 - Li; Hongqi ; et al. | 2020-07-23 |
Traction Device And Traction Method
App 20200055355 - Sun; Shangmin ; et al. | 2020-02-20 |
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Grant 10,546,777 - Li , et al. Ja | 2020-01-28 |
Polishing apparatuses and polishing methods
Grant 10,543,579 - Zhou , et al. Ja | 2020-01-28 |
Fabrication Of Electrodes For Memory Cells
App 20190378975 - Zheng; Pengyuan ; et al. | 2019-12-12 |
Integral preload mechanism for piezoelectric actuator
Grant 10,389,276 - Li A | 2019-08-20 |
Polishing Apparatuses and Polishing Methods
App 20190232457 - Zhou; Jian ; et al. | 2019-08-01 |
Fork-arm Lift Tractor
App 20190193691 - HE; Yuan ; et al. | 2019-06-27 |
Capping poly channel pillars in stacked circuits
Grant 10,319,678 - Li , et al. | 2019-06-11 |
Polishing apparatuses
Grant 10,286,517 - Zhou , et al. | 2019-05-14 |
Polishing Apparatuses and Polishing Methods
App 20190047109 - Zhou; Jian ; et al. | 2019-02-14 |
Vehicle traction system and radiation imaging check system
Grant 10,197,510 - Wang , et al. Fe | 2019-02-05 |
Integrated picomotor mount
Grant 10,161,560 - Li Dec | 2018-12-25 |
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials And Associated Systems, Devices, And Methods
App 20180174902 - Li; Hongqi ; et al. | 2018-06-21 |
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Grant 9,922,875 - Li , et al. March 20, 2 | 2018-03-20 |
Semiconductor constructions and methods of forming intersecting lines of material
Grant 9,911,643 - Li , et al. March 6, 2 | 2018-03-06 |
Low capacitance interconnect structures and associated systems and methods
Grant 9,911,653 - Lu , et al. March 6, 2 | 2018-03-06 |
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials And Associated Systems, Devices, And Methods
App 20170316974 - Li; Hongqi ; et al. | 2017-11-02 |
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Grant 9,754,825 - Li , et al. September 5, 2 | 2017-09-05 |
Vehicle Traction System And Radiation Imaging Check System
App 20170184512 - WANG; Qiangqiang ; et al. | 2017-06-29 |
Vehicle Positioning Apparatus
App 20170184248 - HE; Yuan ; et al. | 2017-06-29 |
Low Capacitance Interconnect Structures And Associated Systems And Methods
App 20170162440 - Lu; Jin ; et al. | 2017-06-08 |
Method For Forming A Metal Cap In A Semiconductor Memory Device
App 20170133585 - Balakrishnan; Muralikrishnan ; et al. | 2017-05-11 |
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
Grant 9,627,295 - Jindal , et al. April 18, 2 | 2017-04-18 |
Low capacitance interconnect structures and associated systems and methods
Grant 9,613,864 - Lu , et al. April 4, 2 | 2017-04-04 |
Method for forming a metal cap in a semiconductor memory device
Grant 9,577,192 - Balakrishnan , et al. February 21, 2 | 2017-02-21 |
Integral Preload Mechanism For Piezoelectric Actuator
App 20160322919 - LI; Hongqi | 2016-11-03 |
Semiconductor Constructions and Methods of Forming Intersecting Lines of Material
App 20160293482 - Li; Hongqi ; et al. | 2016-10-06 |
Flexture-Type Strain Relief Device
App 20160294175 - Li; Hongqi ; et al. | 2016-10-06 |
Capping Poly Channel Pillars In Stacked Circuits
App 20160247756 - Li; Hongqi ; et al. | 2016-08-25 |
Integral preload mechanism for piezoelectric actuator
Grant 9,425,711 - Li August 23, 2 | 2016-08-23 |
Integrated Picomotor Mount
App 20160223127 - LI; Hongqi | 2016-08-04 |
Semiconductor constructions
Grant 9,391,001 - Li , et al. July 12, 2 | 2016-07-12 |
Devices, Systems And Methods For Manufacturing Through-substrate Vias And Front-side Structures
App 20160190042 - Jindal; Anurag ; et al. | 2016-06-30 |
Integrated circuit substrates comprising through-substrate vias and methods of forming through-substrate vias
Grant 9,330,975 - Jindal , et al. May 3, 2 | 2016-05-03 |
Low Capacitance Interconnect Structures And Associated Systems And Methods
App 20160111372 - Lu; Jin ; et al. | 2016-04-21 |
Devices, systems and methods for manufacturing through-substrate vias and front-side structures
Grant 9,305,865 - Jindal , et al. April 5, 2 | 2016-04-05 |
Capping poly channel pillars in stacked circuits
Grant 9,263,459 - Li , et al. February 16, 2 | 2016-02-16 |
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials And Associated Systmes, Devices, And Methods
App 20150340282 - Li; Hongqi ; et al. | 2015-11-26 |
Method For Forming A Metal Cap In A Semiconductor Memory Device
App 20150340247 - Balakrishnan; Muralikrishnan ; et al. | 2015-11-26 |
Integral Preload Mechanism For Piezoelectric Actuator
App 20150295517 - LI; Hongqi | 2015-10-15 |
Interconnect Assemblies With Through-silicon Vias And Stress-relief Features
App 20150243583 - Li; Hongqi ; et al. | 2015-08-27 |
Devices and methods for system-level disk drive vibration and shock testing
Grant 9,116,066 - Tian , et al. August 25, 2 | 2015-08-25 |
Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods
Grant 9,099,442 - Li , et al. August 4, 2 | 2015-08-04 |
Methods Of Exposing Conductive Vias Of Semiconductor Devices And Related Semiconductor Devices
App 20150145146 - Li; Hongqi ; et al. | 2015-05-28 |
Methods of exposing conductive vias of semiconductor devices and associated structures
Grant 9,034,752 - Li , et al. May 19, 2 | 2015-05-19 |
Information storage device with a damping insert sheet between a housing bay and a disk drive
Grant 9,036,295 - Casey , et al. May 19, 2 | 2015-05-19 |
Devices, Systems And Methods For Manufacturing Through-substrate Vias And Front-side Structures
App 20150115445 - Jindal; Anurag ; et al. | 2015-04-30 |
Semiconductor Constructions
App 20150054164 - Li; Hongqi ; et al. | 2015-02-26 |
Conductive Interconnect Structures Incorporating Negative Thermal Expansion Materials And Associated Systems, Devices, And Methods
App 20150035150 - Li; Hongqi ; et al. | 2015-02-05 |
Post-tungsten CMP cleaning solution and method of using the same
Grant 8,911,558 - Li , et al. December 16, 2 | 2014-12-16 |
Methods Of Exposing Conductive Vias Of Semiconductor Devices And Associated Structures
App 20140183740 - Li; Hongqi ; et al. | 2014-07-03 |
Information storage device with a damping insert sheet between a housing bay and a disk drive
Grant 8,705,201 - Casey , et al. April 22, 2 | 2014-04-22 |
Method for fabricating a disk drive base for a disk drive
Grant 8,667,667 - Nguyen , et al. March 11, 2 | 2014-03-11 |
Integrated Circuit Substrates Comprising Through-Substrate Vias And Methods Of Forming Through-Substrate Vias
App 20130320538 - Jindal; Anurag ; et al. | 2013-12-05 |
Information Storage Device With A Damping Insert Sheet Between A Housing Bay And A Disk Drive
App 20130155545 - Casey; Shawn E. ; et al. | 2013-06-20 |
Post-tungsten Cmp Cleaning Solution And Method Of Using The Same
App 20120244705 - LI; Hongqi ; et al. | 2012-09-27 |
Disk drive actuator having a bobbin contacting a closed coil periphery at two locations
Grant 8,125,740 - Yang , et al. February 28, 2 | 2012-02-28 |
Depopulated disk drive head stack assembly having a necked dummy mass with relief alcoves
Grant 8,116,038 - Zhang , et al. February 14, 2 | 2012-02-14 |
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