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Patent applications and USPTO patent grants for li hing leung.The latest application filed is for "wire bonder including a transducer, a bond head, and a mounting apparatus".
Patent | Date |
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Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 08919631 - | 2014-12-30 |
Wire bonder including a transducer, a bond head, and a mounting apparatus Grant 8,919,631 - Wong , et al. December 30, 2 | 2014-12-30 |
Wire Bonder Including A Transducer, A Bond Head, And A Mounting Apparatus App 20130240605 - WONG; Yam Mo ;   et al. | 2013-09-19 |
Flip chip bonding tool Grant 7,458,495 - Fu , et al. December 2, 2 | 2008-12-02 |
Flip chip bonding tool App 20060076391 - Fu; Ran ;   et al. | 2006-04-13 |
Ultrasonic transducer Grant 6,871,770 - Li , et al. March 29, 2 | 2005-03-29 |
Ultrasonic transducer App 20040035912 - LI, Hing Leung ;   et al. | 2004-02-26 |
Ring-shaped piezoelectric transformer having an inner and outer electrode Grant 6,597,084 - Hu , et al. July 22, 2 | 2003-07-22 |
Ultrasonic transducer App 20030062395 - Li, Hing Leung ;   et al. | 2003-04-03 |
Ring-shaped Piezoelectric Transformer Having An Inner And Outer Electrode App 20020130592 - Hu, Jin-Hua ;   et al. | 2002-09-19 |
Rotary motor driven by a piezoelectric composite laminate Grant 5,942,838 - Lee , et al. August 24, 1 | 1999-08-24 |
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