Li; Helen Hongwei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Helen Hongwei.The latest application filed is for "devices including bond pad having protective sidewall seal".
- Li; Helen Hongwei - San Jose CA
| Patent | Date |
|---|---|
| Devices including bond pad having protective sidewall seal Grant 8,963,266 - Li , et al. February 24, 2 | 2015-02-24 |
| Protecting bond pad for subsequent processing Grant 8,536,044 - Li , et al. September 17, 2 | 2013-09-17 |
| Devices Including Bond Pad Having Protective Sidewall Seal App 20120241893 - Li; Helen Hongwei ; et al. | 2012-09-27 |
| Protecting Bond Pad For Subsequent Processing App 20120007199 - Li; Helen Hongwei ; et al. | 2012-01-12 |
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