Li; Chun-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Chun-Yuan.The latest application filed is for "package on package structure and fabrication method thereof".

Company Profile

2.18.18

Li; Chun-Yuan - Taichung TW
- Taichung TW
Li; Chun-Yuan - Taichung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package on package structure and fabrication method thereof Grant 9,362,217 - Lin , et al. June 7, 2	2016-06-07
Fabrication method of semiconductor package having electrical connecting structures Grant 9,177,837 - Lin , et al. November 3, 2	2015-11-03
Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier Grant 9,130,064 - Chan , et al. September 8, 2	2015-09-08
Package On Package Structure And Fabrication Method Thereof App 20150091150 - Lin; Pang-Chun ; et al.	2015-04-02
Semiconductor package structure Grant 8,981,575 - Lin , et al. March 17, 2	2015-03-17
Package structure Grant 8,873,244 - Lin , et al. October 28, 2	2014-10-28
Fabrication Method Of Semiconductor Package Having Electrical Connecting Structures App 20140206146 - Lin; Pang-Chun ; et al.	2014-07-24
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,716,861 - Lin , et al. May 6, 2	2014-05-06
Method For Fabricating Leadframe-based Semiconductor Package App 20140080264 - Chan; Chang-Yueh ; et al.	2014-03-20
Leadframe-based semiconductor package Grant 8,618,641 - Chan , et al. December 31, 2	2013-12-31
Leadframe-based semiconductor package Grant 08618641 -	2013-12-31
Semiconductor Package Structure App 20130200508 - Lin; Pang-Chun ; et al.	2013-08-08
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20130161802 - Lin; Pang-Chun ; et al.	2013-06-27
Semiconductor package structure Grant 8,421,199 - Lin , et al. April 16, 2	2013-04-16
Semiconductor package having electrical connecting structures and fabrication method thereof Grant 8,390,118 - Lin , et al. March 5, 2	2013-03-05
Fabrication method of semiconductor package structure Grant 8,304,268 - Lin , et al. November 6, 2	2012-11-06
Package Structure App 20110157851 - Lin; Pang-Chun ; et al.	2011-06-30
Semiconductor Package Structure App 20110156227 - Lin; Pang-Chun ; et al.	2011-06-30
Fabrication Method Of Semiconductor Package Structure App 20110159643 - Lin; Pang-Chun ; et al.	2011-06-30
Semiconductor Package Having Electrical Connecting Structures And Fabrication Method Thereof App 20110156252 - Lin; Pang-Chun ; et al.	2011-06-30
Package structure fabrication method Grant 7,934,313 - Lin , et al. May 3, 2	2011-05-03
Semiconductor package and method for fabricating the same App 20090039488 - Chan; Chang-Yueh ; et al.	2009-02-12
Semiconductor package and method for fabricating the same App 20080303134 - Li; Chun-Yuan ; et al.	2008-12-11
Carrier-free semiconductor package and fabrication method thereof Grant 7,314,820 - Lin , et al. January 1, 2	2008-01-01
Ground-enhanced semiconductor package and lead frame for the same Grant 7,230,323 - Lee , et al. June 12, 2	2007-06-12
Method of manufacturing quad flat non-leaded semiconductor package App 20070059863 - Li; Chun-Yuan ; et al.	2007-03-15
Wire-bonding method and semiconductor package using the same App 20070007669 - Hsu; Chin-Teng ; et al.	2007-01-11
Wire-bonding method and semiconductor package using the same Grant 7,126,229 - Hsu , et al. October 24, 2	2006-10-24
Lead-frame-based semiconductor package and lead frame thereof App 20060151862 - Lin; Yu-Wei ; et al.	2006-07-13
Carrier-free semiconductor package and fabrication method thereof App 20060121647 - Lin; Yu-Wei ; et al.	2006-06-08
Wire-bonding method and semiconductor package using the same App 20050173791 - Hsu, Chin-Teng ; et al.	2005-08-11
Ground-enhanced semiconductor package and lead frame for the same App 20040238921 - Lee, Yi-Shiung ; et al.	2004-12-02
Leadframe-based non-leaded semiconductor package and method of fabricating the same App 20040217450 - Li, Chun-Yuan ; et al.	2004-11-04

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