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name:-0.01988697052002
name:-0.011518001556396
name:-0.0026140213012695
Li; Ching-Chih Patent Filings

Li; Ching-Chih

Patent Applications and Registrations

Patent applications and USPTO patent grants for Li; Ching-Chih.The latest application filed is for "device for testing chip or die with better system ir drop".

Company Profile
3.11.16
  • Li; Ching-Chih - Hsinchu City TW
  • Li; Ching-Chih - New Taipei TW
  • LI; Ching-Chih - New Taipei City TW
  • Li; Ching-Chih - Taipei County TW
  • Li, Ching-Chih - Taipei City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device For Testing Chip Or Die With Better System Ir Drop
App 20200326368 - Li; Ching-Chih ;   et al.
2020-10-15
Semiconductor integrated circuit device
Grant 10,581,414 - Liao , et al.
2020-03-03
Integrated circuit, electronic device and method for transmitting data in electronic device
Grant 9,978,692 - Chang , et al. May 22, 2
2018-05-22
Layout method for printed circuit board
Grant 9,846,756 - Pan , et al. December 19, 2
2017-12-19
Semiconductor Integrated Circuit Device
App 20170111032 - LIAO; Chun-Neng ;   et al.
2017-04-20
Integrated Circuit, Electronic Device And Method For Transmitting Data In Electronic Device
App 20160233174 - CHANG; PoHao ;   et al.
2016-08-11
Chip Package With Embedded Passive Device
App 20160218092 - Chang; Po-Hao ;   et al.
2016-07-28
Layout Method For Printed Circuit Board
App 20150379180 - PAN; Fu-Kang ;   et al.
2015-12-31
Layout Method For Printed Circuit Board
App 20150379184 - PAN; Fu-Kang ;   et al.
2015-12-31
Leadframe package for high-speed data rate applications
Grant 8,525,310 - Chen , et al. September 3, 2
2013-09-03
Quad flat package with exposed common electrode bars
Grant 8,283,757 - Chen , et al. October 9, 2
2012-10-09
Semiconductor device and fabricating method thereof
Grant 8,258,615 - Chang , et al. September 4, 2
2012-09-04
Leadframe Package For High-speed Data Rate Applications
App 20110248394 - Chen; Nan-Jang ;   et al.
2011-10-13
Semiconductor chip having conductive member for reducing localized voltage drop
Grant 7,880,297 - Jao , et al. February 1, 2
2011-02-01
Layout circuit
Grant 7,816,610 - Li October 19, 2
2010-10-19
Quad Flat Package With Exposed Common Electrode Bars
App 20100207260 - Chen; Nan-Cheng ;   et al.
2010-08-19
Semiconductor Device And Fabricating Method Thereof
App 20090224393 - Chang; Sheng-Ming ;   et al.
2009-09-10
Circuit And Circuit Design Method
App 20090187874 - Wu; Mao-Lin ;   et al.
2009-07-23
Memory controllers and pad sequence control methods thereof
Grant 7,561,481 - Chen , et al. July 14, 2
2009-07-14
Semiconductor Chip
App 20090166849 - Jao; Che-Yuan ;   et al.
2009-07-02
Memory systems and memory access methods
Grant 7,486,105 - Li February 3, 2
2009-02-03
Quad Flat Package With Exposed Common Electrode Bars
App 20090020859 - CHEN; Nan-Cheng ;   et al.
2009-01-22
Memory Controllers And Pad Sequence Control Methods Thereof
App 20080304352 - Chen; Nan-Cheng ;   et al.
2008-12-11
Layout Circuit
App 20080257583 - Li; Ching-Chih
2008-10-23
Memory Systems And Memory Access Methods
App 20080177913 - Li; Ching-Chih
2008-07-24
Method For Co-layout Of Different Buses In An Electric Board
App 20040174807 - Li, Ching-Chih
2004-09-09

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