Li; Chien-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Li; Chien-Chen.The latest application filed is for "semiconductor device and method".
- Li; Chien-Chen - Hsinchu TW
- Li; Chien-Chen - Hsin-Chu TW
- Li; Chien-Chen - Hualien TW
- Li; Chien-Chen - Hualien City TW
| Patent | Date |
|---|---|
| Semiconductor Device and Method App 20220223550 - Chen; Chen-Shien ; et al. | 2022-07-14 |
| Chip Package Structure With Ring-like Structure App 20210375821 - YANG; Sheng-Yao ; et al. | 2021-12-02 |
| Chip package structure including ring-like structure and method for forming the same Grant 11,088,108 - Yang , et al. August 10, 2 | 2021-08-10 |
| Method For Forming Package Structure With A Barrier Layer App 20210035937 - CHEN; Cheng-Hung ; et al. | 2021-02-04 |
| Chip Package Structure And Method For Forming The Same App 20200411467 - YANG; Sheng-Yao ; et al. | 2020-12-31 |
| Package structure with a barrier layer and method for forming the same Grant 10,811,377 - Chen , et al. October 20, 2 | 2020-10-20 |
| Package Structure And Method For Forming The Same App 20190189577 - CHEN; Cheng-Hung ; et al. | 2019-06-20 |
| Method for forming package structure including intermetallic compound Grant 10,170,429 - Huang , et al. J | 2019-01-01 |
| Immersion de-taping Grant 10,056,275 - Liu , et al. August 21, 2 | 2018-08-21 |
| Method for forming semiconductor device structure with bumps Grant 10,014,218 - Shih , et al. July 3, 2 | 2018-07-03 |
| Package Structure And Method For Forming The Same App 20180151537 - HUANG; Heng-Chi ; et al. | 2018-05-31 |
| Immersion De-taping App 20170186632 - Liu; Ching Tasi ; et al. | 2017-06-29 |
| Immersion de-taping Grant 9,613,845 - Liu , et al. April 4, 2 | 2017-04-04 |
| Two step molding grinding for packaging applications Grant 9,209,048 - Huang , et al. December 8, 2 | 2015-12-08 |
| Immersion De-taping App 20150206784 - Liu; Ching Tasi ; et al. | 2015-07-23 |
| Two Step Molding Grinding For Packaging Applications App 20150187607 - Huang; Wen-Chun ; et al. | 2015-07-02 |
| Process for fabricating non-volatile memory by tilt-angle ion implantation Grant 7,179,708 - Jeng , et al. February 20, 2 | 2007-02-20 |
| Process for fabricating non-volatile memory by tilt-angle ion implantation App 20060019441 - Jeng; Erik S. ; et al. | 2006-01-26 |
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