| Patent | Date |
|---|
Long Channel And Short Channel Vertical Fet Co-integration For Vertical Fet Vtfet
App 20220139909 - Hook; Terence B. ; et al. | 2022-05-05 |
Mim Capacitor Structures
App 20220139820 - LIANG; JIM SHIH-CHUN ; et al. | 2022-05-05 |
Footing flare pedestal structure
Grant 11,302,639 - Yang , et al. April 12, 2 | 2022-04-12 |
Interconnect and memory structures formed in the BEOL
Grant 11,282,788 - Yang , et al. March 22, 2 | 2022-03-22 |
Switchable metal insulator metal capacitor
Grant 11,276,748 - Li , et al. March 15, 2 | 2022-03-15 |
E-fuse co-processed with MIM capacitor
Grant 11,257,750 - Li , et al. February 22, 2 | 2022-02-22 |
Long channel and short channel vertical FET co-integration for vertical FET VTFET
Grant 11,251,179 - Hook , et al. February 15, 2 | 2022-02-15 |
On integrated circuit (IC) device simultaneously formed capacitor and resistor
Grant 11,244,850 - Liang , et al. February 8, 2 | 2022-02-08 |
Bottom conductive structure with a limited top contact area
Grant 11,239,278 - Yang , et al. February 1, 2 | 2022-02-01 |
Enhancement of iso-via reliability
Grant 11,227,796 - Clevenger , et al. January 18, 2 | 2022-01-18 |
Interconnect architecture with enhanced reliability
Grant 11,205,588 - Li , et al. December 21, 2 | 2021-12-21 |
Bilayer barrier for interconnect and memory structures formed in the BEOL
Grant 11,195,751 - Yang , et al. December 7, 2 | 2021-12-07 |
Embedded small via anti-fuse device
Grant 11,177,213 - Yang , et al. November 16, 2 | 2021-11-16 |
Metalization repair in semiconductor wafers
Grant 11,171,063 - Clevenger , et al. November 9, 2 | 2021-11-09 |
Metalization repair in semiconductor wafers
Grant 11,171,064 - Clevenger , et al. November 9, 2 | 2021-11-09 |
Interconnect and memory structures having reduced topography variation formed in the BEOL
Grant 11,164,878 - Yang , et al. November 2, 2 | 2021-11-02 |
Electrical fuse with metal line migration
Grant 11,152,300 - Li , et al. October 19, 2 | 2021-10-19 |
Integrated circuit (IC) device integral capacitor and anti-fuse
Grant 11,145,591 - Liang , et al. October 12, 2 | 2021-10-12 |
Semiconductor via structure with lower electrical resistance
Grant 11,145,543 - Clevenger , et al. October 12, 2 | 2021-10-12 |
Bottom electrode structure and method of forming the same
Grant 11,133,462 - Yang , et al. September 28, 2 | 2021-09-28 |
On Integrated Circuit (ic) Device Capacitor Between Metal Lines
App 20210287984 - Li; Baozhen ; et al. | 2021-09-16 |
Sub-ground rule e-Fuse structure
Grant 11,121,082 - Kim , et al. September 14, 2 | 2021-09-14 |
Rram Structures In The Beol
App 20210280638 - Li; Baozhen ; et al. | 2021-09-09 |
Contacts Having A Geometry To Reduce Resistance
App 20210272902 - Clevenger; Lawrence A. ; et al. | 2021-09-02 |
EFuse structure with multiple links
Grant 11,101,213 - Li , et al. August 24, 2 | 2021-08-24 |
Electromigration test structures for void localization
Grant 11,099,230 - Li , et al. August 24, 2 | 2021-08-24 |
Hybrid Interconnect With A Reliability Liner In Wide Features
App 20210257299 - Yang; Chih-Chao ; et al. | 2021-08-19 |
E-fuse Co-processed With Mim Capacitor
App 20210249348 - Li; Baozhen ; et al. | 2021-08-12 |
Bottom Conductive Structure With A Limited Top Contact Area
App 20210242278 - Yang; Chih-Chao ; et al. | 2021-08-05 |
Interconnect And Memory Structures Having Reduced Topography Variation Formed In The Beol
App 20210242216 - Yang; Chih-Chao ; et al. | 2021-08-05 |
Embedded Small Via Anti-fuse Device
App 20210233843 - Yang; Chih-Chao ; et al. | 2021-07-29 |
Efuse Structure With Multiple Links
App 20210233844 - LI; BAOZHEN ; et al. | 2021-07-29 |
Footing Flare Pedestal Structure
App 20210225774 - Yang; Chih-Chao ; et al. | 2021-07-22 |
Contacts having a geometry to reduce resistance
Grant 11,062,993 - Clevenger , et al. July 13, 2 | 2021-07-13 |
Low resistance high capacitance density MIM capacitor
Grant 11,031,457 - Li , et al. June 8, 2 | 2021-06-08 |
On Integrated Circuit (ic) Device Simultaneously Formed Capacitor And Resistor
App 20210151345 - Liang; Jim Shih-Chun ; et al. | 2021-05-20 |
Integrated Circuit (ic) Device Integral Capacitor And Anti-fuse
App 20210151373 - Liang; Jim Shih-Chun ; et al. | 2021-05-20 |
Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device
Grant 10,998,263 - Liang , et al. May 4, 2 | 2021-05-04 |
BEOL electrical fuse
Grant 10,971,447 - Yang , et al. April 6, 2 | 2021-04-06 |
Dielectric crack stop for advanced interconnects
Grant 10,964,647 - Li , et al. March 30, 2 | 2021-03-30 |
Advanced crack stop structure
Grant 10,957,657 - Yang , et al. March 23, 2 | 2021-03-23 |
Bilayer Barrier For Interconnect And Memory Structures Formed In The Beol
App 20210082751 - Yang; Chih-Chao ; et al. | 2021-03-18 |
Precision BEOL resistors
Grant 10,943,972 - Li , et al. March 9, 2 | 2021-03-09 |
Advanced interconnects containing an IMT liner
Grant 10,930,589 - Maniscalco , et al. February 23, 2 | 2021-02-23 |
Low resistance contact for transistors
Grant 10,923,575 - Clevenger , et al. February 16, 2 | 2021-02-16 |
Switchable Metal Insulator Metal Capacitor
App 20210036096 - Li; Baozhen ; et al. | 2021-02-04 |
Interconnect And Memory Structures Formed In The Beol
App 20210028107 - Yang; Chih-Chao ; et al. | 2021-01-28 |
Fabricating vias with lower resistance
Grant 10,903,117 - Li , et al. January 26, 2 | 2021-01-26 |
Fabrication Of Phase Change Memory Cell In Integrated Circuit
App 20210020836 - Li; Baozhen ; et al. | 2021-01-21 |
Interconnect Architecture With Enhanced Reliability
App 20210013097 - Li; Baozhen ; et al. | 2021-01-14 |
Beol Electrical Fuse And Method Of Forming The Same
App 20200402907 - Yang; Chih-Chao ; et al. | 2020-12-24 |
Back End Of Line (beol) Time Dependent Dielectric Breakdown (tddb) Mitigation Within A Vertical Interconnect Access (via) Level Of An Integrated Circuit (ic) Device
App 20200395294 - Liang; Jim Shih-Chun ; et al. | 2020-12-17 |
Bottom Electrode Structure And Method Of Forming The Same
App 20200388757 - Yang; Chih-Chao ; et al. | 2020-12-10 |
Advanced crack stop structure
Grant 10,847,475 - Yang , et al. November 24, 2 | 2020-11-24 |
BEOL electrical fuse and method of forming the same
Grant 10,847,458 - Yang , et al. November 24, 2 | 2020-11-24 |
Advanced crack stop structure
Grant 10,840,194 - Yang , et al. November 17, 2 | 2020-11-17 |
Advanced crack stop structure
Grant 10,840,195 - Yang , et al. November 17, 2 | 2020-11-17 |
Fabrication of phase change memory cell in integrated circuit
Grant 10,840,447 - Li , et al. November 17, 2 | 2020-11-17 |
Sub-ground Rule E-fuse Structure
App 20200335440 - Kim; Andrew T. ; et al. | 2020-10-22 |
Sub-ground rule e-Fuse structure
Grant 10,811,353 - Li , et al. October 20, 2 | 2020-10-20 |
Semiconductor device and method of forming the semiconductor device
Grant 10,784,159 - Clevenger , et al. Sept | 2020-09-22 |
Fabrication Of Phase Change Memory Cell In Integrated Circuit
App 20200295261 - Li; Baozhen ; et al. | 2020-09-17 |
Reliable Resistive Random Access Memory
App 20200287136 - Li; Baozhen ; et al. | 2020-09-10 |
Fabricating Vias With Lower Resistance
App 20200286780 - Li; Baozhen ; et al. | 2020-09-10 |
BEOL thin film resistor
Grant 10,770,393 - Kim , et al. Sep | 2020-09-08 |
Circular ring shaped antifuse device
Grant 10,763,210 - Yang , et al. Sep | 2020-09-01 |
Collar formation for chamfer-less and chamfered vias
Grant 10,741,441 - Li , et al. A | 2020-08-11 |
Circular Ring Shaped Antifuse Device
App 20200219811 - Yang; Chih-Chao ; et al. | 2020-07-09 |
Method of optimizing wire RC for device performance and reliability
Grant 10,699,950 - Clevenger , et al. | 2020-06-30 |
Contacts Having A Geometry To Reduce Resistance
App 20200194371 - Clevenger; Lawrence A. ; et al. | 2020-06-18 |
Graded interconnect cap
Grant 10,651,083 - Kim , et al. | 2020-05-12 |
Contacts having a geometry to reduce resistance
Grant 10,636,738 - Clevenger , et al. | 2020-04-28 |
Sub-ground Rule E-fuse Structure
App 20200126911 - Li; Baozhen ; et al. | 2020-04-23 |
Advanced Crack Stop Structure
App 20200118943 - Yang; Chih-Chao ; et al. | 2020-04-16 |
Vertical Electrical Fuse
App 20200111741 - Yang; Chih-Chao ; et al. | 2020-04-09 |
MIM capacitor for improved process defect tolerance
Grant 10,615,112 - Li , et al. | 2020-04-07 |
Collar Formation For Chamfer-less And Chamfered Vias
App 20200105590 - Li; Baozhen ; et al. | 2020-04-02 |
Advanced Crack Stop Structure
App 20200051930 - Yang; Chih-Chao ; et al. | 2020-02-13 |
Advanced Crack Stop Structure
App 20200035620 - Yang; Chih-Chao ; et al. | 2020-01-30 |
Advanced Crack Stop Structure
App 20200035621 - Yang; Chih-Chao ; et al. | 2020-01-30 |
Advanced Interconnects Containing An Imt Liner
App 20200027829 - Maniscalco; Joseph F. ; et al. | 2020-01-23 |
Integrated circuit chip reliability qualification using a sample-specific expected fail rate
Grant 10,539,611 - Bickford , et al. Ja | 2020-01-21 |
Hybrid back end of line metallization to balance performance and reliability
Grant 10,534,888 - Li , et al. Ja | 2020-01-14 |
Enhancement Of Iso-via Reliability
App 20200013671 - Clevenger; Lawrence A. ; et al. | 2020-01-09 |
Low Resistance Contact For Transistors
App 20200013868 - CLEVENGER; LAWRENCE A. ; et al. | 2020-01-09 |
Semiconductor Via Structure With Lower Electrical Resistance
App 20190371663 - Clevenger; Lawrence A. ; et al. | 2019-12-05 |
Semiconductor Device And Method Of Forming The Semiconductor Device
App 20190363013 - CLEVENGER; Lawrence A. ; et al. | 2019-11-28 |
Advanced crack stop structure
Grant 10,490,513 - Yang , et al. Nov | 2019-11-26 |
Dielectric Crack Stop For Advanced Interconnects
App 20190348377 - Li; Baozhen ; et al. | 2019-11-14 |
Advanced crack stop structure
Grant 10,475,753 - Yang , et al. Nov | 2019-11-12 |
Mim Capacitor For Improved Process Defect Tolerance
App 20190341347 - Li; Baozhen ; et al. | 2019-11-07 |
Advanced interconnects containing an IMT liner
Grant 10,468,346 - Maniscalco , et al. No | 2019-11-05 |
Low resistance contact for transistors
Grant 10,468,491 - Clevenger , et al. No | 2019-11-05 |
Semiconductor via structure with lower electrical resistance
Grant 10,460,990 - Clevenger , et al. Oc | 2019-10-29 |
Enhancement of iso-via reliability
Grant 10,460,985 - Clevenger , et al. Oc | 2019-10-29 |
Advanced Interconnects Containing An Imt Liner
App 20190311985 - Maniscalco; Joseph F. ; et al. | 2019-10-10 |
Advanced Crack Stop Structure
App 20190304928 - Yang; Chih-Chao ; et al. | 2019-10-03 |
Advanced Crack Stop Structure
App 20190304929 - Yang; Chih-Chao ; et al. | 2019-10-03 |
Beol Thin Film Resistor
App 20190295947 - Kim; Andrew Tae ; et al. | 2019-09-26 |
Precision Beol Resistors
App 20190280080 - Li; Baozhen ; et al. | 2019-09-12 |
Graded Interconnect Cap
App 20190273022 - Kim; Andrew Tae ; et al. | 2019-09-05 |
Dielectric crack stop for advanced interconnects
Grant 10,396,042 - Li , et al. A | 2019-08-27 |
Precision BEOL resistors
Grant 10,361,265 - Li , et al. | 2019-07-23 |
Hybrid Back End Of Line Metallization To Balance Performance And Reliability
App 20190205496 - Li; Baozhen ; et al. | 2019-07-04 |
Precision BEOL resistors
Grant 10,340,330 - Li , et al. | 2019-07-02 |
Precision BEOL resistors
Grant 10,332,955 - Li , et al. | 2019-06-25 |
Precision beol resistors
Grant 10,332,956 - Li , et al. | 2019-06-25 |
Low Resistance High Capacitance Density Mim Capacitor
App 20190189735 - Li; Baozhen ; et al. | 2019-06-20 |
Electromigration Test Structures For Void Localization
App 20190162775 - Li; Baozhen ; et al. | 2019-05-30 |
Dielectric Crack Stop For Advanced Interconnects
App 20190139904 - Li; Baozhen ; et al. | 2019-05-09 |
Precision Beol Resistors
App 20190115420 - Li; Baozhen ; et al. | 2019-04-18 |
Precision Beol Resistors
App 20190115419 - Li; Baozhen ; et al. | 2019-04-18 |
Precision Beol Resistors
App 20190115421 - Li; Baozhen ; et al. | 2019-04-18 |
Precision Beol Resistors
App 20190115418 - Li; Baozhen ; et al. | 2019-04-18 |
Three plate MIM capacitor via integrity verification
Grant 10,262,934 - Kim , et al. | 2019-04-16 |
Semiconductor device and method of forming the semiconductor device
Grant 10,256,145 - Clevenger , et al. | 2019-04-09 |
Three plate MIM capacitor via integrity verification
Grant 10,229,873 - Kim , et al. | 2019-03-12 |
Methodology to prevent metal lines from current pulse damage
Grant 10,216,870 - Bickford , et al. Feb | 2019-02-26 |
Protective Liner Between A Gate Dielectric And A Gate Contact
App 20190013238 - Clevenger; Lawrence A. ; et al. | 2019-01-10 |
Metalization Repair In Semiconductor Wafers
App 20190006248 - Clevenger; Lawrence A. ; et al. | 2019-01-03 |
Test structures for dielectric reliability evaluations
Grant 10,103,060 - Brochu, Jr. , et al. October 16, 2 | 2018-10-16 |
System and method for managing semiconductor manufacturing defects
Grant 10,089,161 - Bickford , et al. October 2, 2 | 2018-10-02 |
Interconnect structure with capacitor element and related methods
Grant 10,090,240 - Li , et al. October 2, 2 | 2018-10-02 |
Protective liner between a gate dielectric and a gate contact
Grant 10,083,862 - Clevenger , et al. September 25, 2 | 2018-09-25 |
Contacts Having A Geometry To Reduce Resistance
App 20180261543 - Clevenger; Lawrence A. ; et al. | 2018-09-13 |
Interconnect structure having tungsten contact copper wiring
Grant 10,062,647 - Stamper , et al. August 28, 2 | 2018-08-28 |
Three Plate Mim Capacitor Via Integrity Verification
App 20180226338 - Kim; Andrew T. ; et al. | 2018-08-09 |
Three Plate Mim Capacitor Via Integrity Verification
App 20180226339 - Kim; Andrew T. ; et al. | 2018-08-09 |
Electronic fuse having an insulation layer
Grant 10,020,256 - Burke , et al. July 10, 2 | 2018-07-10 |
Contacts having a geometry to reduce resistance
Grant 10,014,255 - Clevenger , et al. July 3, 2 | 2018-07-03 |
Method of optimizing wire RC for device performance and reliability
Grant 9,997,408 - Clevenger , et al. June 12, 2 | 2018-06-12 |
Method Of Optimizing Wire Rc For Device Performance And Reliability
App 20180158731 - Clevenger; Lawrence A. ; et al. | 2018-06-07 |
Semiconductor device and method of forming the semiconductor device
Grant 9,966,308 - Clevenger , et al. May 8, 2 | 2018-05-08 |
Semiconductor Device And Method Of Forming The Semiconductor Device
App 20180122697 - Clevenger; Lawrence A. ; et al. | 2018-05-03 |
Compound Resistor Structure For Semiconductor Device
App 20180102318 - Christiansen; Cathryn J. ; et al. | 2018-04-12 |
Burn-in power performance optimization
Grant 9,940,430 - Bickford , et al. April 10, 2 | 2018-04-10 |
Semiconductor Device And Method Of Forming The Semiconductor Device
App 20180096890 - CLEVENGER; Lawrence A. ; et al. | 2018-04-05 |
Metalization Repair In Semiconductor Wafers
App 20180096858 - Clevenger; Lawrence A. ; et al. | 2018-04-05 |
Metalization Repair In Semiconductor Wafers
App 20180096902 - Clevenger; Lawrence A. ; et al. | 2018-04-05 |
Protective Liner Between A Gate Dielectric And A Gate Contact
App 20180076086 - Clevenger; Lawrence A. ; et al. | 2018-03-15 |
System And Method For Managing Semiconductor Manufacturing Defects
App 20180074874 - Bickford; Jeanne P. S. ; et al. | 2018-03-15 |
Semiconductor Via Structure With Lower Electrical Resistance
App 20180061707 - Clevenger; Lawrence A. ; et al. | 2018-03-01 |
Integrated Circuit Chip Reliability Qualification Using A Sample-specific Expected Fail Rate
App 20180052201 - Bickford; Jeanne P. ; et al. | 2018-02-22 |
Integrated circuit chip reliability qualification using a sample-specific expected fail rate
Grant 9,891,275 - Bickford , et al. February 13, 2 | 2018-02-13 |
System and method for managing semiconductor manufacturing defects
Grant 9,880,892 - Bickford , et al. January 30, 2 | 2018-01-30 |
Long Channel And Short Channel Vertical Fet Co-integration For Vertical Fet Vtfet
App 20180006025 - Hook; Terence B. ; et al. | 2018-01-04 |
Interconnect Structure With Capacitor Element And Related Methods
App 20170352619 - Li; Baozhen ; et al. | 2017-12-07 |
Semiconductor via structure with lower electrical resistance
Grant 9,837,309 - Clevenger , et al. December 5, 2 | 2017-12-05 |
Enhancement Of Iso-via Reliability
App 20170316970 - Clevenger; Lawrence A. ; et al. | 2017-11-02 |
Interconnect Structure Having Tungsten Contact Copper Wiring
App 20170309573 - Stamper; Anthony K. ; et al. | 2017-10-26 |
On-chip usable life depletion meter and associated method
Grant 9,791,502 - Bickford , et al. October 17, 2 | 2017-10-17 |
Optimized wires for resistance or electromigration
Grant 9,768,116 - Clevenger , et al. September 19, 2 | 2017-09-19 |
Contacts Having A Geometry To Reduce Resistance
App 20170263557 - Clevenger; Lawrence A. ; et al. | 2017-09-14 |
Enhancement of iso-via reliability
Grant 9,761,482 - Clevenger , et al. September 12, 2 | 2017-09-12 |
Interconnect structure having tungsten contact copper wiring
Grant 9,761,526 - Stamper , et al. September 12, 2 | 2017-09-12 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations
Grant 9,759,766 - Bonilla , et al. September 12, 2 | 2017-09-12 |
Interconnect Structure Having Tungsten Contact Copper Wiring
App 20170221831 - Stamper; Anthony K. ; et al. | 2017-08-03 |
Resistance Measurement-dependent Integrated Circuit Chip Reliability Estimation
App 20170212165 - Bickford; Jeanne P. ; et al. | 2017-07-27 |
Optimized wires for resistance or electromigration
Grant 9,711,452 - Clevenger , et al. July 18, 2 | 2017-07-18 |
Methodology To Prevent Metal Lines From Current Pulse Damage
App 20170199949 - BICKFORD; JEANNE P. S. ; et al. | 2017-07-13 |
Electromigration Test Structure For Cu Barrier Integrity And Blech Effect Evaluations
App 20170176514 - BONILLA; GRISELDA ; et al. | 2017-06-22 |
Optimized wires for resistance or electromigration
Grant 9,685,407 - Clevenger , et al. June 20, 2 | 2017-06-20 |
Burn-in Power Performance Optimization
App 20170161426 - Bickford; Jeanne P. ; et al. | 2017-06-08 |
Semiconductor Via Structure With Lower Electrical Resistance
App 20170148673 - Clevenger; Lawrence A. ; et al. | 2017-05-25 |
Structure And Process For W Contacts
App 20170148675 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Structure And Process For W Contacts
App 20170148736 - Edelstein; Daniel C. ; et al. | 2017-05-25 |
Structure and process for W contacts
Grant 9,659,817 - Edelstein , et al. May 23, 2 | 2017-05-23 |
Structure and process for W contacts
Grant 9,653,403 - Edelstein , et al. May 16, 2 | 2017-05-16 |
Integrated circuit chip reliability using reliability-optimized failure mechanism targeting
Grant 9,639,645 - Bickford , et al. May 2, 2 | 2017-05-02 |
System and method for identifying operating temperatures and modifying of integrated circuits
Grant 9,625,325 - Bickford , et al. April 18, 2 | 2017-04-18 |
Method Of Optimizing Wire Rc For Device Performance And Reliability
App 20170098577 - Clevenger; Lawrence A. ; et al. | 2017-04-06 |
Dual damascene structure with liner
Grant 9,576,880 - Li , et al. February 21, 2 | 2017-02-21 |
Interconnect structure
Grant 9,570,389 - Badami , et al. February 14, 2 | 2017-02-14 |
Electrical fuse with metal line migration
Grant 9,548,270 - Li , et al. January 17, 2 | 2017-01-17 |
Integrated Circuit Chip Reliability Qualification Using A Sample-specific Expected Fail Rate
App 20160377674 - Bickford; Jeanne P. ; et al. | 2016-12-29 |
Optimized Wires For Resistance Or Electromigration
App 20160379927 - CLEVENGER; Lawrence A. ; et al. | 2016-12-29 |
Optimized Wires For Resistance Or Electromigration
App 20160379877 - CLEVENGER; Lawrence A. ; et al. | 2016-12-29 |
Test Structures For Dielectric Reliability Evaluations
App 20160372389 - Brochu, JR.; David G. ; et al. | 2016-12-22 |
Integrated Circuit Chip Reliability Using Reliability-optimized Failure Mechanism Targeting
App 20160371413 - Bickford; Jeanne P. ; et al. | 2016-12-22 |
Interconnect structure
Grant 9,514,981 - Badami , et al. December 6, 2 | 2016-12-06 |
Reliability-optimized selective voltage binning
Grant 9,489,482 - Bickford , et al. November 8, 2 | 2016-11-08 |
On-chip Usable Life Depletion Meter And Associated Method
App 20160320214 - Bickford; Jeanne P. ; et al. | 2016-11-03 |
Electromigration test structure for Cu barrier integrity and blech effect evaluations
Grant 9,472,477 - Bonilla , et al. October 18, 2 | 2016-10-18 |
Systems And Methods To Prevent Incorporation Of A Used Integrated Circuit Chip Into A Product
App 20160238653 - Bickford; Jeanne P. ; et al. | 2016-08-18 |
System And Method For Identifying Operating Temperatures And Modifying Of Integrated Circuits
App 20160240479 - Bickford; Jeanne P. ; et al. | 2016-08-18 |
Structure and process for W contacts
Grant 9,406,617 - Edelstein , et al. August 2, 2 | 2016-08-02 |
Optimized Wires For Resistance Or Electromigration
App 20160163651 - CLEVENGER; Lawrence A. ; et al. | 2016-06-09 |
Semiconductor devices with enhanced electromigration performance
Grant 9,362,229 - Gambino , et al. June 7, 2 | 2016-06-07 |
System integrator and system integration method with reliability optimized integrated circuit chip selection
Grant 9,354,953 - Bickford , et al. May 31, 2 | 2016-05-31 |
Dual damascene structure with liner
Grant 9,312,203 - Li , et al. April 12, 2 | 2016-04-12 |
Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variations
Grant 9,287,185 - Bonilla , et al. March 15, 2 | 2016-03-15 |
System Integrator And System Integration Method With Reliability Optimized Integrated Circuit Chip Selection
App 20160026517 - Bickford; Jeanne P. ; et al. | 2016-01-28 |
Updating Reliability Predictions Using Manufacturing Assessment Data
App 20160019328 - Bickford; Jeanne P. ; et al. | 2016-01-21 |
Electrical Fuse With Metal Line Migration
App 20160005690 - LI; BAOZHEN ; et al. | 2016-01-07 |
Method to improve fine Cu line reliability in an integrated circuit device
Grant 9,224,640 - Burke , et al. December 29, 2 | 2015-12-29 |
Enhancement Of Iso-via Reliability
App 20150364365 - Clevenger; Lawrence A. ; et al. | 2015-12-17 |
Copper interconnect structures and methods of making same
Grant 9,159,653 - Yang , et al. October 13, 2 | 2015-10-13 |
Enhancement Of Iso-via Reliability
App 20150255388 - Clevenger; Lawrence A. ; et al. | 2015-09-10 |
Programmable electrical fuse
Grant 9,129,964 - Coyner , et al. September 8, 2 | 2015-09-08 |
System And Method For Managing Semiconductor Manufacturing Defects
App 20150241511 - Bickford; Jeanne P. S. ; et al. | 2015-08-27 |
Semiconductor device reliability model and methodologies for use thereof
Grant 9,064,087 - Bickford , et al. June 23, 2 | 2015-06-23 |
In-situ computing system failure avoidance
Grant 9,058,250 - Bickford , et al. June 16, 2 | 2015-06-16 |
Electronic Fuse Having An Insulation Layer
App 20150130019 - Burke; Chad M. ; et al. | 2015-05-14 |
Dielectric reliability assessment for advanced semiconductors
Grant 9,026,981 - Li , et al. May 5, 2 | 2015-05-05 |
Semiconductor Device Reliability Model And Methodologies For Use Thereof
App 20150106780 - BICKFORD; Jeanne P. ; et al. | 2015-04-16 |
Electronic fuse having an insulation layer
Grant 8,999,767 - Burke , et al. April 7, 2 | 2015-04-07 |
Electrical fuse and method of making the same
Grant 8,952,486 - Yang , et al. February 10, 2 | 2015-02-10 |
Dual Damascene Structure With Liner
App 20150035155 - Li; Baozhen ; et al. | 2015-02-05 |
Semiconductor Devices With Enhanced Electromigration Performance
App 20150035158 - GAMBINO; Jeffrey P. ; et al. | 2015-02-05 |
In-situ Computing System Failure Avoidance
App 20150033081 - Bickford; Jeanne P.S. ; et al. | 2015-01-29 |
Semiconductor device reliability model and methodologies for use thereof
Grant 8,943,444 - Bickford , et al. January 27, 2 | 2015-01-27 |
Remote Electromigration Monitoring Of Electronic Chips
App 20150016486 - Hutcheon; Graeme A. ; et al. | 2015-01-15 |
Electromigration resistant via-to-line interconnect
Grant 8,922,022 - Li , et al. December 30, 2 | 2014-12-30 |
Electromigration resistant via-to-line interconnect
Grant 08922022 - | 2014-12-30 |
Semiconductor Device Reliability Model And Methodologies For Use Thereof
App 20140380261 - BICKFORD; Jeanne P. ; et al. | 2014-12-25 |
Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor
Grant 8,901,738 - Gambino , et al. December 2, 2 | 2014-12-02 |
Dielectric Reliability Assessment For Advanced Semiconductors
App 20140351785 - LI; BAOZHEN ; et al. | 2014-11-27 |
Electrical fuses and methods of making electrical fuses
Grant 8,896,090 - Hogle , et al. November 25, 2 | 2014-11-25 |
Programmable Electrical Fuse
App 20140319650 - Coyner; Jason ; et al. | 2014-10-30 |
Copper Interconnect Structures And Methods Of Making Same
App 20140264878 - Yang; Chih-Chao ; et al. | 2014-09-18 |
Remote Electromigration Monitoring Of Electronic Chips
App 20140278247 - Hutcheon; Graeme A. ; et al. | 2014-09-18 |
Dielectric reliability assessment for advanced semiconductors
Grant 8,839,180 - Li , et al. September 16, 2 | 2014-09-16 |
Electrical Fuses And Methods Of Making Electrical Fuses
App 20140239439 - Hogle; Nicholas R. ; et al. | 2014-08-28 |
Interconnect structure with an electromigration and stress migration enhancement liner
Grant 8,802,559 - Yang , et al. August 12, 2 | 2014-08-12 |
Copper interconnect structures and methods of making same
Grant 8,802,558 - Yang , et al. August 12, 2 | 2014-08-12 |
Electronic Fuse Having An Insulation Layer
App 20140210041 - Burke; Chad M. ; et al. | 2014-07-31 |
Silicide Formation in High-Aspect Ratio Structures
App 20140206190 - LI; BAOZHEN ; et al. | 2014-07-24 |
3D via capacitor with a floating conductive plate for improved reliability
Grant 8,779,491 - Yang , et al. July 15, 2 | 2014-07-15 |
Dual Damascene Structure With Liner
App 20140183739 - Li; Baozhen ; et al. | 2014-07-03 |
Interconnect Structure With An Electromigration And Stress Migration Enhancement Liner
App 20140162450 - Yang; Chih-Chao ; et al. | 2014-06-12 |
Stackable programmable passive device and a testing method
Grant 8,749,293 - Chen , et al. June 10, 2 | 2014-06-10 |
Semiconductor Devices With Enhanced Electromigration Performance
App 20140131878 - Gambino; Jeffrey P. ; et al. | 2014-05-15 |
Method and system to predict a number of electromigration critical elements
Grant 8,726,201 - Bickford , et al. May 13, 2 | 2014-05-13 |
Copper Interconnect Structures And Methods Of Making Same
App 20140124933 - Yang; Chih-Chao ; et al. | 2014-05-08 |
Interconnect structure with an electromigration and stress migration enhancement liner
Grant 8,659,156 - Yang , et al. February 25, 2 | 2014-02-25 |
Method To Improve Fine Cu Line Reliability In An Integrated Circuit Device
App 20140048927 - Burke; Chad M. ; et al. | 2014-02-20 |
Integrated circuit design method and system
Grant 8,656,325 - Barwin , et al. February 18, 2 | 2014-02-18 |
Semiconductor switching device and method of making the same
Grant 8,642,460 - Yang , et al. February 4, 2 | 2014-02-04 |
3D via capacitor with a floating conductive plate for improved reliability
Grant 8,609,504 - Yang , et al. December 17, 2 | 2013-12-17 |
Self-aligned Metal-insulator-metal (mim) Capacitor
App 20130328167 - Yang; Chih-Chao ; et al. | 2013-12-12 |
Integrated Circuit Design Method And System
App 20130185684 - Barwin; John E. ; et al. | 2013-07-18 |
3d Via Capacitor With A Floating Conductive Plate For Improved Reliability
App 20130161791 - Yang; Chih-Chao ; et al. | 2013-06-27 |
3d Via Capacitor With A Floating Conductive Plate For Improved Reliability
App 20130164905 - Yang; Chih-Chao ; et al. | 2013-06-27 |
Interconnect Structure With An Electromigration and Stress Migration Enhancement Liner
App 20130093089 - YANG; Chih-Chao ; et al. | 2013-04-18 |
Electrically programmable metal fuse
Grant 8,421,186 - Li , et al. April 16, 2 | 2013-04-16 |
3D via capacitor with a floating conductive plate for improved reliability
Grant 8,405,135 - Yang , et al. March 26, 2 | 2013-03-26 |
Electrical Fuse With Metal Line Migration
App 20130071998 - Li; Baozhen ; et al. | 2013-03-21 |
Semiconductor Switching Device And Method Of Making The Same
App 20120313194 - Yang; Chih-Chao ; et al. | 2012-12-13 |
Electrically Programmable Metal Fuse
App 20120306048 - Li; Baozhen ; et al. | 2012-12-06 |
Stackable programmable passive device and a testing method
Grant 8,294,505 - Chen , et al. October 23, 2 | 2012-10-23 |
Stackable Programmable Passive Device And A Testing Method
App 20120261724 - Chen; Fen ; et al. | 2012-10-18 |
Electrical Fuse And Method Of Making The Same
App 20120261793 - Yang; Chih-Chao ; et al. | 2012-10-18 |
Determining critical current density for interconnect
Grant 8,232,809 - Burke , et al. July 31, 2 | 2012-07-31 |
Electromigration Resistant Via-to-line Interconnect
App 20120119366 - Li; Baozhen ; et al. | 2012-05-17 |
3d Via Capacitor With A Floating Conductive Plate For Improved Reliability
App 20120080771 - Yang; Chih-Chao ; et al. | 2012-04-05 |
Electromigration resistant via-to-line interconnect
Grant 8,114,768 - Li , et al. February 14, 2 | 2012-02-14 |
Method And System To Predict A Number Of Electromigration Critical Elements
App 20110283249 - BICKFORD; Jeanne P. ; et al. | 2011-11-17 |
Programming of laser fuse
Grant 7,981,732 - Badami , et al. July 19, 2 | 2011-07-19 |
Structures and methods to enhance Cu interconnect electromigration (EM) performance
Grant 7,981,771 - Li July 19, 2 | 2011-07-19 |
Hybrid metallic wire and methods of fabricating same
Grant 7,955,971 - Yang , et al. June 7, 2 | 2011-06-07 |
Determining Critical Current Density For Interconnect
App 20110115508 - Burke; Chad M. ; et al. | 2011-05-19 |
Hybrid Metallic Wire And Methods Of Fabricating Same
App 20100314764 - Yang; Chih-Chao ; et al. | 2010-12-16 |
Via bottom contact and method of manufacturing same
Grant 7,830,019 - Chanda , et al. November 9, 2 | 2010-11-09 |
Interconnect With Recessed Dielectric Adjacent A Noble Metal Cap
App 20100176514 - Yang; Chih-Chao ; et al. | 2010-07-15 |
Electromigration Resistant Via-to-line Interconnect
App 20100164116 - Li; Baozhen ; et al. | 2010-07-01 |
Interconnect with recessed dielectric adjacent a noble metal cap
Grant 7,745,324 - Yang , et al. June 29, 2 | 2010-06-29 |
Structure for modeling stress-induced degradation of conductive interconnects
Grant 7,692,439 - Chanda , et al. April 6, 2 | 2010-04-06 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,649,262 - Chapple-Sokol , et al. January 19, 2 | 2010-01-19 |
Structure for monitoring stress-induced degradation of conductive interconnects
Grant 7,639,032 - Chanda , et al. December 29, 2 | 2009-12-29 |
Structures and Methods to Enhance CU Interconnect Electromigration (EM) Performance
App 20090302476 - Li; Baozhen | 2009-12-10 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20090294968 - Chapple-Sokol; Jonathan D. ; et al. | 2009-12-03 |
VIA bottom contact and method of manufacturing same
Grant 7,585,764 - Chanda , et al. September 8, 2 | 2009-09-08 |
Via Bottom Contact And Method Of Manufacturing Same
App 20090200673 - Chanda; Kaushik ; et al. | 2009-08-13 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,572,650 - Chapple-Sokol , et al. August 11, 2 | 2009-08-11 |
Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime
Grant 7,500,208 - Chen , et al. March 3, 2 | 2009-03-03 |
Slots To Reduce Electromigration Failure In Back End Of Line Structure
App 20090014884 - Li; Baozhen | 2009-01-15 |
Structure for modeling stress-induced degradation of conductive interconnects
App 20080231312 - Chanda; Kaushik ; et al. | 2008-09-25 |
Programming Of Laser Fuse
App 20080194064 - Badami; Dinesh A. ; et al. | 2008-08-14 |
Structure and method for monitoring stress-induced degradation of conductive interconnects
Grant 7,397,260 - Chanda , et al. July 8, 2 | 2008-07-08 |
Structure and programming of laser fuse
Grant 7,384,824 - Badami , et al. June 10, 2 | 2008-06-10 |
Method for monitoring stress-induced degradation of conductive interconnects
App 20080107149 - Chanda; Kaushik ; et al. | 2008-05-08 |
Microelectronic Structure Including High Current Density Resistor
App 20070284662 - Chinthakindi; Anil K. ; et al. | 2007-12-13 |
Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits
Grant 7,231,617 - Chen , et al. June 12, 2 | 2007-06-12 |
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime
App 20070130551 - Chen; Fen ; et al. | 2007-06-07 |
Structure And Method For Monitoring Stress-induced Degradation Of Conductive Interconnects
App 20070115018 - Chanda; Kaushik ; et al. | 2007-05-24 |
Stackable Programmable Passive Device And A Testing Method
App 20070103228 - Chen; Fen ; et al. | 2007-05-10 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20070040277 - Chapple-Sokol; Jonathan D. ; et al. | 2007-02-22 |
Via Bottom Contact And Method Of Manufacturing Same
App 20070037403 - Chanda; Kaushik ; et al. | 2007-02-15 |
Suppression of localized metal precipitate formation and corresponding metallization depletion in semiconductor processing
Grant 7,173,338 - Chapple-Sokol , et al. February 6, 2 | 2007-02-06 |
Copper to aluminum interlayer interconnect using stud and via liner
Grant 7,087,997 - Burrell , et al. August 8, 2 | 2006-08-08 |
Structure and programming of laser fuse
App 20060145291 - Badami; Dinesh A. ; et al. | 2006-07-06 |
Structure and programming of laser fuse
Grant 7,064,409 - Badami , et al. June 20, 2 | 2006-06-20 |
Copper to aluminum interlayer interconnect using stud and via liner
Grant 7,037,824 - Burrell , et al. May 2, 2 | 2006-05-02 |
Non-destructive Evaluation Of Microstructure And Interface Roughness Of Electrically Conducting Lines In Semiconductor Integrated Circuits In Deep Sub-micron Regime
App 20060071676 - Chen; Fen ; et al. | 2006-04-06 |
Liner with improved electromigration redundancy for damascene interconnects
Grant 6,992,390 - Edelstein , et al. January 31, 2 | 2006-01-31 |
Suppression Of Localized Metal Precipitate Formation And Corresponding Metallization Depletion In Semiconductor Processing
App 20050194689 - Chapple-Sokol, Jonathan D. ; et al. | 2005-09-08 |
Liner with improved electromigration redundancy for damascene interconnects
App 20050098897 - Edelstein, Daniel C. ; et al. | 2005-05-12 |
Structure And Programming Of Laser Fuse
App 20050093091 - Badami, Dinesh A. ; et al. | 2005-05-05 |
Copper to aluminum interlayer interconnect using stud and via liner
App 20040207092 - Burrell, Lloyd G. ; et al. | 2004-10-21 |
Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others
Grant 6,794,706 - Chen , et al. September 21, 2 | 2004-09-21 |
Negative differential resistance reoxidized nitride silicon-based photodiode and method
Grant 6,743,655 - Chen , et al. June 1, 2 | 2004-06-01 |
Applications of space-charge-limited conduction induced current increase in nitride-oxide dielectric capacitors: voltage regulator for power supply system and others
App 20040012046 - Chen, Fen ; et al. | 2004-01-22 |
Negative differential resistance reoxidized nitride silicon-based photodiode and method
App 20020185703 - Chen, Fen ; et al. | 2002-12-12 |
Copper to aluminum interlayer interconnect using stud and via liner
App 20020127846 - Burrell, Lloyd G. ; et al. | 2002-09-12 |
Lanthanum manganite-based air electrode for solid oxide fuel cells
Grant 5,916,700 - Ruka , et al. June 29, 1 | 1999-06-29 |
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