LEWISON; David J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEWISON; David J..The latest application filed is for "tamper-respondent assemblies with porous heat transfer element(s)".

Company Profile

1.4.7

LEWISON; David J. - LaGrangeville NY
Lewison; David J. - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tamper-respondent Assemblies With Porous Heat Transfer Element(s) App 20220192011 - ZHANG; Hongqing ; et al.	2022-06-16
High Power Device Fault Localization Via Die Surface Contouring App 20220155049 - Lewison; David J. ; et al.	2022-05-19
Conformal integrated circuit (IC) device package lid Grant 11,158,562 - Lewison , et al. October 26, 2	2021-10-26
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover Grant 11,156,409 - Zhang , et al. October 26, 2	2021-10-26
Conformal Integrated Circuit (IC) Device Package Lid App 20210249333 - Lewison; David J. ; et al.	2021-08-12
Lid/heat Spreader Having Targeted Flexibility App 20210233825 - LI; SHIDONG ; et al.	2021-07-29
Coolant-cooled Heat Sinks With Internal Thermally-conductive Fins Joined To The Cover App 20210222956 - ZHANG; Hongqing ; et al.	2021-07-22
Non-destructive Bond Line Thickness Measurement Of Thermal Interface Material On Silicon Packages App 20210123729 - Zhang; Hongqing ; et al.	2021-04-29
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins Grant 10,842,043 - Zhang , et al. November 17, 2	2020-11-17
Selectively Soluble Standoffs For Chip Joining App 20170170148 - Fasano; Benjamin V. ; et al.	2017-06-15
Selectively soluble standoffs for chip joining Grant 9,673,177 - Fasano , et al. June 6, 2	2017-06-06

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