Lewis; Theron Lee

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lewis; Theron Lee.The latest application filed is for "heated press-fit connection".

Company Profile

5.11.10

Lewis; Theron Lee - Rochester MN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reliability enhancement of press fit connectors Grant 11,456,548 - Hoffmeyer , et al. September 27, 2	2022-09-27
Localized rework using liquid media soldering Grant 11,445,650 - Lewis , et al. September 13, 2	2022-09-13
Heated Press-fit Connection App 20220278470 - Dangler; John R. ; et al.	2022-09-01
Press-fit insertion method Grant 11,424,562 - Dangler , et al. August 23, 2	2022-08-23
Electromagnetic Shielding Of Heatsinks With Spring Press-fit Pins App 20220029361 - Braun; David J. ; et al.	2022-01-27
Stutter step press-fit connector insertion process Grant 11,211,760 - Jennings , et al. December 28, 2	2021-12-28
Dye and pry process for surface mount technology dual in-line memory module Grant 11,166,401 - Lewis , et al. November 2, 2	2021-11-02
Heated Press-fit Connection App 20210273355 - Dangler; John R. ; et al.	2021-09-02
Localized Rework Using Liquid Media Soldering App 20210120712 - Lewis; Theron Lee ; et al.	2021-04-22
Reliability Enhancement Of Press Fit Connectors App 20210083410 - Hoffmeyer; Mark K. ; et al.	2021-03-18
Stutter Step Press-fit Connector Insertion Process App 20210075179 - Jennings; Timothy ; et al.	2021-03-11
Barrier for hybrid socket movement reduction Grant 10,834,839 - Lewis , et al. November 10, 2	2020-11-10
Dye And Pry Process For Surface Mount Technology Dual In-line Memory Module App 20200352068 - Lewis; Theron Lee ; et al.	2020-11-05
Efficient placement of grid array components Grant 10,756,009 - Hoffmeyer , et al. A	2020-08-25
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,632,127 - Beaman , et al. December 15, 2	2009-12-15
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,530,853 - Beaman , et al. May 12, 2	2009-05-12
Method for manufacturing a socket that compensates for differing coefficients of thermal expansion Grant 7,472,477 - Beaman , et al. January 6, 2	2009-01-06
Socket and Method for Compensating for Differing Coefficients of Thermal Expansion App 20080182443 - Beaman; Brian Samuel ; et al.	2008-07-31
Socket and method for compensating for differing coefficients of thermal expansion App 20080090439 - Beaman; Brian Samuel ; et al.	2008-04-17
Socket And Method For Compensating For Differing Coefficients Of Thermal Expansion App 20080090440 - Beaman; Brian Samuel ; et al.	2008-04-17
Socket and method for compensating for differing coefficients of thermal expansion Grant 7,303,443 - Beaman , et al. December 4, 2	2007-12-04

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