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Patent applications and USPTO patent grants for Lew; Blake J..The latest application filed is for "chemical mechanical planarization (cmp) composition and methods therefore for copper and through silica via (tsv) applications".
Patent | Date |
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Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications Grant 11,401,441 - Shi , et al. August 2, 2 | 2022-08-02 |
Dishing reducing in tungsten chemical mechanical polishing Grant 10,570,313 - Stender , et al. Feb | 2020-02-25 |
Chemical Mechanical Planarization (CMP) Composition and Methods Therefore for Copper and Through Silica Via (TSV) Applications App 20190055430 - Shi; Xiaobo ;   et al. | 2019-02-21 |
Dishing Reducing In Tungsten Chemical Mechanical Polishing App 20160237315 - Stender; Matthias ;   et al. | 2016-08-18 |
Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor App 20160122590 - Lew; Blake J. ;   et al. | 2016-05-05 |
Chemical Mechanical Planarization for Tungsten-Containing Substrates App 20140273458 - Shi; Xiaobo ;   et al. | 2014-09-18 |
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