Levy; Karl B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Levy; Karl B..The latest application filed is for "methods for forming all tungsten contacts and lines".

Company Profile

0.26.8

Levy; Karl B. - Los Altos CA US
Levy; Karl B. - Saratoga CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods for forming all tungsten contacts and lines Grant 8,367,546 - Humayun , et al. February 5, 2	2013-02-05
Method for improving uniformity and adhesion of low resistivity tungsten film Grant 8,329,576 - Chan , et al. December 11, 2	2012-12-11
Architecture for high throughput semiconductor processing applications Grant 8,192,131 - Stevens , et al. June 5, 2	2012-06-05
Methods For Forming All Tungsten Contacts And Lines App 20120040530 - HUMAYUN; Raashina ; et al.	2012-02-16
Methods for forming all tungsten contacts and lines Grant 8,053,365 - Humayun , et al. November 8, 2	2011-11-08
Method For Improving Uniformity And Adhesion Of Low Resistivity Tungsten Film App 20100273327 - Chan; Lana Hiului ; et al.	2010-10-28
Method for improving uniformity and adhesion of low resistivity tungsten film Grant 7,772,114 - Chan , et al. August 10, 2	2010-08-10
Deposition of tungsten nitride Grant 7,691,749 - Levy , et al. April 6, 2	2010-04-06
Methods For Forming All Tungsten Contacts And Lines App 20090163025 - Humayun; Raashina ; et al.	2009-06-25
Method For Improving Uniformity And Adhesion Of Low Resistivity Tungsten Film App 20090149022 - Chan; Lana Hiului ; et al.	2009-06-11
Method of forming low-resistivity tungsten interconnects Grant 7,262,125 - Wongsenakhum , et al. August 28, 2	2007-08-28
Method for reducing tungsten film roughness and improving step coverage Grant 7,141,494 - Lee , et al. November 28, 2	2006-11-28
Deposition of tungsten nitride App 20060094238 - Levy; Karl B. ; et al.	2006-05-04
Deposition of tungsten nitride Grant 7,005,372 - Levy , et al. February 28, 2	2006-02-28
Architecture for high throughput semiconductor processing applications Grant 6,977,014 - Stevens , et al. December 20, 2	2005-12-20
Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing Grant 6,905,959 - Ashtiani , et al. June 14, 2	2005-06-14
Atomic layer deposition systems and methods Grant 6,902,620 - Omstead , et al. June 7, 2	2005-06-07
Method for reducing tungsten film roughness and improving step coverage App 20050031786 - Lee, Sang-Hyeob ; et al.	2005-02-10
Method of forming low-resistivity tungsten interconnects App 20040202786 - Wongsenakhum, Panya ; et al.	2004-10-14
Deposition of tungsten nitride App 20040142557 - Levy, Karl B. ; et al.	2004-07-22
Passivation of copper in dual damascene metalization Grant 6,554,914 - Rozbicki , et al. April 29, 2	2003-04-29
Method of depositing diffusion barrier for copper interconnect in integrated circuit Grant 6,534,404 - Danek , et al. March 18, 2	2003-03-18
Control of erosion profile and process characteristics in magnetron sputtering by geometrical shaping of the sputtering target Grant 6,500,321 - Ashtiani , et al. December 31, 2	2002-12-31
Apparatus and method for controlling plasma uniformity across a substrate Grant 6,497,796 - Ashtiani , et al. December 24, 2	2002-12-24
Apparatus and method for enhanced degassing of semiconductor wafers for increased throughput Grant 6,497,734 - Barber , et al. December 24, 2	2002-12-24
Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source Grant 6,193,854 - Lai , et al. February 27, 2	2001-02-27
Apparatus and method for controlling plasma uniformity across a substrate Grant 6,179,973 - Lai , et al. January 30, 2	2001-01-30
Plasma etch system Grant 5,976,310 - Levy November 2, 1	1999-11-02
Multilayer diffusion barriers Grant 5,942,799 - Danek , et al. August 24, 1	1999-08-24
Optical monitoring of growth and etch rate of materials Grant 5,465,154 - Levy November 7, 1	1995-11-07
Magnetically enhanced plasma reactor system for semiconductor processing Grant 5,225,024 - Hanley , et al. July 6, 1	1993-07-06
Method for forming capacitor in trench of semiconductor wafer by implantation of trench surfaces with oxygen Grant 5,183,775 - Levy February 2, 1	1993-02-02
Corrosion-free aluminum etching process for fabricating an integrated circuit structure Grant 5,126,008 - Levy June 30, 1	1992-06-30

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