Levine; Ernest
Patent Applications and Registrations
Patent applications and USPTO patent grants for Levine; Ernest.The latest application filed is for "stacked via-stud with improved reliability in copper metallurgy".
- Levine; Ernest - Poughkeepsie NY
| Patent | Date |
|---|---|
| Stacked via-stud with improved reliability in copper metallurgy App 20060014376 - Agarwala; Birendra N. ; et al. | 2006-01-19 |
| Stacked via-stud with improved reliability in copper metallurgy Grant 6,972,209 - Agarwala , et al. December 6, 2 | 2005-12-06 |
| Stacked via-stud with improved reliability in copper metallurgy App 20040101663 - Agarwala, Birendra N. ; et al. | 2004-05-27 |
| Adhesion of silicon carbide films Grant 6,252,295 - Cote , et al. June 26, 2 | 2001-06-26 |
| Methods for metal etching with reduced sidewall build up during integrated circuit manufacturing Grant 5,846,884 - Naeem , et al. December 8, 1 | 1998-12-08 |
| Automated non-visual method of locating periodically arranged sub-micron objects Grant 5,747,802 - Arnold , et al. May 5, 1 | 1998-05-05 |
| NCAGE Code | 7RAT9 | LEVINE, ERNEST |
| CAGE Code | 7RAT9 | LEVINE, ERNEST |
| DUNS | 080456836 | Levine, Ernest |
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