Leung; Wilson
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leung; Wilson.The latest application filed is for "separate probe and bond regions of an integrated circuit".
- Leung; Wilson - San Francisco CA
- Leung; Wilson - Tsimshatsu Cowloon HK
- Leung; Wilson - Kowloon HK
| Patent | Date |
|---|---|
| Flipchip bump patterns for efficient I-mesh power distribution schemes Grant 8,350,375 - Ali , et al. January 8, 2 | 2013-01-08 |
| Separate probe and bond regions of an integrated circuit Grant 8,115,321 - Ali , et al. February 14, 2 | 2012-02-14 |
| Separate Probe And Bond Regions Of An Integrated Circuit App 20100276816 - ALI; ANWAR ; et al. | 2010-11-04 |
| Flipchip Bump Patterns For Efficient I-mesh Power Distribution Schemes App 20090283904 - Ali; Anwar ; et al. | 2009-11-19 |
| Pacifier Grant 4,768,510 - Leung September 6, 1 | 1988-09-06 |
| Toy puzzle Grant D297,032 - Leung August 2, 1 | 1988-08-02 |
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