Leung; Wai
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leung; Wai.The latest application filed is for "nanoscale high-aspect-ratio metallic structure and method of manufacturing same".
- Leung; Wai - Ames IA
- Leung; Wai - Stamford CT
Trademarks
| Patent | Date |
|---|---|
| Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same App 20120031487 - Kuang; Ping ; et al. | 2012-02-09 |
| Nanoscale High-Aspect-Ratio Metallic Structure and Method of Manufacturing Same App 20110203656 - Kuang; Ping ; et al. | 2011-08-25 |
| Footwear emitting a fragrance and a method for its fabrication App 20070209229 - Maxner; Joseph N. ; et al. | 2007-09-13 |
| Footwear emitting a fragrance and method for its fabrication App 20060042126 - Maxner; Joseph N. ; et al. | 2006-03-02 |
| Fabrication of photonic band gap materials using microtransfer molded templates Grant 6,555,406 - Leung , et al. April 29, 2 | 2003-04-29 |
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