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name:-0.0044569969177246
name:-0.0040280818939209
name:-0.00057601928710938
Leung; Wai Kin Patent Filings

Leung; Wai Kin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leung; Wai Kin.The latest application filed is for "material for forming a multi-level antimicrobial surface coating and its preparation".

Company Profile
0.4.3
  • Leung; Wai Kin - Hong Kong CN
  • Leung; Wai Kin - Hong King CN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Material for forming a multi-level antimicrobial surface coating and its preparation
Grant 8,968,758 - Yeung , et al. March 3, 2
2015-03-03
Material For Forming A Multi-level Antimicrobial Surface Coating And Its Preparation
App 20140341961 - Yeung; King Lun ;   et al.
2014-11-20
Material for forming a multi-level antimicrobial surface coating and its preparation
Grant 8,741,325 - Yeung , et al. June 3, 2
2014-06-03
Material For Forming A Multi-level Antimicrobial Surface Coating And Its Preparation
App 20100158851 - Yeung; King Lun ;   et al.
2010-06-24
Molecular sieve and zeolite microneedles and preparation thereof
Grant 7,699,819 - Yeung , et al. April 20, 2
2010-04-20
Molecular Sieve And Zeolite Microneedles And Preparation Thereof
App 20070280878 - Yeung; King Lun ;   et al.
2007-12-06

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