Leung; Silqun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leung; Silqun.The latest application filed is for "semiconductor chip package with undermount passive devices".
- Leung; Silqun - Richmond Hill N/A CA
| Patent | Date |
|---|---|
| Semiconductor chip package with undermount passive devices Grant 9,607,935 - Martinez , et al. March 28, 2 | 2017-03-28 |
| Semiconductor chip substrate with multi-capacitor footprint Grant 8,012,874 - Li , et al. September 6, 2 | 2011-09-06 |
| Semiconductor Chip Package with Undermount Passive Devices App 20100265682 - Martinez; Liane ; et al. | 2010-10-21 |
| Semiconductor Chip Substrate with Multi-Capacitor Footprint App 20090152690 - Li; Yue ; et al. | 2009-06-18 |
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