Leung; Pak

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leung; Pak.The latest application filed is for "method for estimating sediment content of a hydroprocessed hydrocarbon-containing feedstock".

Company Profile

1.10.11

Leung; Pak - San Ramon CA
Leung; Pak - Cedar Park TX
Leung; Pak - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Estimating Sediment Content Of A Hydroprocessed Hydrocarbon-containing Feedstock App 20190170725 - Rogel; Estrella ; et al.	2019-06-06
Method for predicting sediment content of a hydroprocessed hydrocarbon product Grant 9,921,203 - Rogel , et al. March 20, 2	2018-03-20
Multiple step anneal method and semiconductor formed by multiple step anneal Grant 9,018,089 - Liniger , et al. April 28, 2	2015-04-28
Method For Predicting Sediment Content Of A Hydroprocessed Hydrocarbon Product App 20130124105 - Rogel; Estrella ; et al.	2013-05-16
Method For Estimating Sediment Content Of A Hydroprocessed Hydrocarbon-containing Feedstock App 20130124106 - Rogel; Estrella ; et al.	2013-05-16
Multiple Step Anneal Method And Semiconductor Formed By Multiple Step Anneal App 20130049207 - Liniger; Eric G. ; et al.	2013-02-28
Generation of metal holes by via mutation Grant 8,378,493 - Wong , et al. February 19, 2	2013-02-19
Generation Of Metal Holes By Via Mutation App 20110079921 - Wong; Robert C. ; et al.	2011-04-07
Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutation Grant 7,875,544 - Wong , et al. January 25, 2	2011-01-25
Forming interconnects with air gaps Grant 7,790,601 - Choi , et al. September 7, 2	2010-09-07
Generation of metal holes by via mutation App 20070118828 - Wong; Robert C. ; et al.	2007-05-24
Generation of metal holes by via mutation Grant 7,188,321 - Wong , et al. March 6, 2	2007-03-06
Stress-relief layer for semiconductor applications Grant 6,960,835 - Barth , et al. November 1, 2	2005-11-01
Generation of metal holes by via mutation App 20050098898 - Wong, Robert C. ; et al.	2005-05-12
Stress-relief layer for semiconductor applications App 20050093159 - Barth, Hans-Joachim ; et al.	2005-05-05

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.