Leung; Dickson
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leung; Dickson.The latest application filed is for "dust-proof plug for mobile phone".
- Leung; Dickson - San Francisco CA US
- Leung; Dickson - Shanghai CN
| Patent | Date |
|---|---|
| Online mortgage approval and settlement system and method therefor Grant 8,706,592 - Tealdi , et al. April 22, 2 | 2014-04-22 |
| Dust-Proof Plug for Mobile Phone App 20130316569 - Leung; Dickson | 2013-11-28 |
| Online Mortgage Approval And Settlement System And Method Therefor App 20120185375 - Tealdi; Daniel A. ; et al. | 2012-07-19 |
| Online mortgage approval and settlement system and method therefor Grant 8,145,556 - Tealdi , et al. March 27, 2 | 2012-03-27 |
| Online mortgage approval and settlement system and method therefor App 20010029482 - Tealdi, Daniel A. ; et al. | 2001-10-11 |
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