Leung; Chi Kuen Vincent
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leung; Chi Kuen Vincent.The latest application filed is for "stacked electronic components, method and apparatus for aligning electronic components".
- Leung; Chi Kuen Vincent - Hong Kong HK
- Leung; Chi Kuen Vincent - Tin Shui Wai HK
- Leung; Chi Kuen Vincent - Shatin HK
| Patent | Date |
|---|---|
| Apparatus for aligning electronic components Grant 8,544,165 - Leung , et al. October 1, 2 | 2013-10-01 |
| Electronic package with stacked modules with channels passing through metal layers of the modules Grant 8,194,411 - Leung , et al. June 5, 2 | 2012-06-05 |
| Bonding method for through-silicon-via based 3D wafer stacking Grant 8,030,208 - Leung , et al. October 4, 2 | 2011-10-04 |
| Stacked Electronic Components, Method and Apparatus for Aligning Electronic Components App 20110235299 - Leung; Chi Kuen Vincent ; et al. | 2011-09-29 |
| Module for Use in a Multi Package Assembly and a Method of Making the Module and the Multi Package Assembly App 20110147908 - Sun; Peng ; et al. | 2011-06-23 |
| Multi-chip package Grant 7,832,278 - Sham , et al. November 16, 2 | 2010-11-16 |
| Electronic Package And Method Of Fabrication Thereof App 20100246141 - Leung; Chi Kuen Vincent ; et al. | 2010-09-30 |
| Multi-chip Package App 20090293604 - Sham; Man Lung ; et al. | 2009-12-03 |
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