LEUNG; Chi Keung

Patent Applications and Registrations

Patent applications and USPTO patent grants for LEUNG; Chi Keung.The latest application filed is for "ejector unit for detaching an electronic element from an adhesive carrier".

Company Profile

1.6.6

LEUNG; Chi Keung - Hong Kong HK
Leung; Chi Keung - Kanata N/A CA
Leung; Chi Keung - Subiaco Western Australia AU

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ejector Unit For Detaching An Electronic Element From An Adhesive Carrier App 20210339405 - LEUNG; Chi Keung ; et al.	2021-11-04
Apparatus and method of determining a bonding position of a die Grant 10,311,597 - Lam , et al.	2019-06-04
Apparatus And Method Of Determining A Bonding Position Of A Die App 20180350097 - LAM; Kui Kam ; et al.	2018-12-06
Dynamic characterization of a communication device Grant 9,544,702 - Schulz , et al. January 10, 2	2017-01-10
Dynamic Characterization of a Communication Device App 20150030168 - Schulz; Dieter ; et al.	2015-01-29
Automatic level adjustment for die bonder Grant 8,293,043 - Chung , et al. October 23, 2	2012-10-23
Automatic Level Adjustment For Die Bonder App 20080017293 - Chung; Kwok Kee ; et al.	2008-01-24
Method and apparatus for connecting broadband voice and data signals to telephone systems Grant 6,674,845 - Ayoub , et al. January 6, 2	2004-01-06
Fluid displacing blade Grant 6,354,804 - Leung March 12, 2	2002-03-12
Method and apparatus for connecting broadband voice and data signals to telephone systems App 20020015482 - Ayoub, Mark ; et al.	2002-02-07

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