loadpatents
Patent applications and USPTO patent grants for Leung; Calvin.The latest application filed is for "prosthetic limb sleeve".
Patent | Date |
---|---|
Integrated multi-sensor module Grant 11,009,477 - Le Neel , et al. May 18, 2 | 2021-05-18 |
Flexible electrochemical micro-sensor Grant 10,905,362 - Le Neel , et al. February 2, 2 | 2021-02-02 |
Prosthetic Limb Sleeve App 20210000621 - Leung; Calvin ;   et al. | 2021-01-07 |
Flexible Electrochemical Micro-sensor App 20190261899 - LE NEEL; Olivier ;   et al. | 2019-08-29 |
Integrated Multi-sensor Module App 20190257780 - LE NEEL; Olivier ;   et al. | 2019-08-22 |
Integrated multi-sensor module Grant 10,317,357 - Le Neel , et al. | 2019-06-11 |
Flexible electrochemical micro-sensor Grant 10,299,711 - Le Neel , et al. | 2019-05-28 |
Integrated Multi-sensor Module App 20190025236 - Le Neel; Olivier ;   et al. | 2019-01-24 |
Integrated multi-sensor module Grant 10,094,797 - Le Neel , et al. October 9, 2 | 2018-10-09 |
Flexible Electrochemical Micro-sensor App 20180140234 - LE NEEL; Olivier ;   et al. | 2018-05-24 |
Flexible electrochemical micro-sensor Grant 9,918,667 - Le Neel , et al. March 20, 2 | 2018-03-20 |
Method and apparatus for SAS open address frame processing in SAS expanders Grant 9,866,658 - Yi , et al. January 9, 2 | 2018-01-09 |
Integrated Multi-sensor Module App 20170261458 - Le Neel; Olivier ;   et al. | 2017-09-14 |
Integrated multi-sensor module Grant 9,689,824 - Le Neel , et al. June 27, 2 | 2017-06-27 |
Accumulated power consumption sensor: application in smart batteries systems Grant 9,651,627 - Le Neel , et al. May 16, 2 | 2017-05-16 |
Method And Apparatus For Sas Open Address Frame Processing In Sas Expanders App 20170099371 - YI; Cheng ;   et al. | 2017-04-06 |
Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device Grant 9,530,681 - Leung , et al. December 27, 2 | 2016-12-27 |
Combo bio and temperature disposable sensor on flexible foil Grant 9,437,798 - Le Neel , et al. September 6, 2 | 2016-09-06 |
Method To Provide The Thinnest And Variable Substrate Thickness For Reliable Plastic And Flexible Electronic Device App 20160118289 - LEUNG; Calvin ;   et al. | 2016-04-28 |
Integrated Multi-sensor Module App 20160041114 - Le Neel; Olivier ;   et al. | 2016-02-11 |
Method to provide the thinnest and variable substrate thickness for reliable plastic and flexible electronic device Grant 9,257,423 - Leung , et al. February 9, 2 | 2016-02-09 |
Integrated multi-sensor module Grant 9,176,089 - Le Neel , et al. November 3, 2 | 2015-11-03 |
Flexible Electrochemical Micro-sensor App 20150253276 - Le Neel; Olivier ;   et al. | 2015-09-10 |
Method To Provide The Thinnest And Variable Substrate Thickness For Reliable Plastic And Flexible Electronic Device App 20150145137 - Leung; Calvin ;   et al. | 2015-05-28 |
Combo Bio And Temperature Disposable Sensor On Flexible Foil App 20150001075 - Le Neel; Olivier ;   et al. | 2015-01-01 |
Accumulated Power Consumption Sensor: Application In Smart Batteries Systems App 20140292344 - Le Neel; Olivier ;   et al. | 2014-10-02 |
Integrated Multi-sensor Module App 20140291677 - Le Neel; Olivier ;   et al. | 2014-10-02 |
Thin film metal-dielectric-metal transistor Grant 8,809,861 - Le Neel , et al. August 19, 2 | 2014-08-19 |
Heater design for heat-trimmed thin film resistors Grant 8,786,396 - Leung , et al. July 22, 2 | 2014-07-22 |
Lateral connection for a via-less thin film resistor Grant 8,659,085 - Ng , et al. February 25, 2 | 2014-02-25 |
Vialess integration for dual thin films--thin film resistor and heater Grant 8,558,654 - Le Neel , et al. October 15, 2 | 2013-10-15 |
Multi-layer via-less thin film resistor Grant 8,436,426 - Le Neel , et al. May 7, 2 | 2013-05-07 |
Via-less thin film resistor with a dielectric cap Grant 8,400,257 - Lim , et al. March 19, 2 | 2013-03-19 |
Thin Film Metal-dielectric-metal Transistor App 20120168754 - Le Neel; Olivier ;   et al. | 2012-07-05 |
Heater design for heat-trimmed thin film resistors App 20120119872 - Leung; Calvin ;   et al. | 2012-05-17 |
Vialess Integration For Dual Thin Films - Thin Film Resistor And Heater App 20120112873 - Le Neel; Olivier ;   et al. | 2012-05-10 |
Multi-layer Via-less Thin Film Resistor App 20120049324 - Le Neel; Olivier ;   et al. | 2012-03-01 |
Via-less Thin Film Resistor With A Dielectric Cap App 20120049997 - Lim; Ting Fang ;   et al. | 2012-03-01 |
Lateral Connection For A Via-less Thin Film Resistor App 20120049323 - Ng; Hui Chong Vince ;   et al. | 2012-03-01 |
Connection management in serial attached SCSI (SAS) expanders Grant 8,095,722 - Liao , et al. January 10, 2 | 2012-01-10 |
Connection management in serial attached SCSI (SAS) expanders Grant 7,584,319 - Liao , et al. September 1, 2 | 2009-09-01 |
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