| Patent | Date |
|---|
Coating apparatus and method of forming coating film
Grant 10,864,530 - Wang , et al. December 15, 2 | 2020-12-15 |
Semiconductor device having a shallow trench isolation structure and methods of forming the same
Grant 10,867,838 - Lin , et al. December 15, 2 | 2020-12-15 |
Method for controlling plasma in semiconductor fabrication
Grant 10,867,787 - Wu , et al. December 15, 2 | 2020-12-15 |
Thermal chemical vapor deposition system and operating method thereof
Grant 10,724,140 - Lo , et al. | 2020-07-28 |
Semiconductor Device And Method For Forming The Same
App 20200203473 - LIN; Chun-Li ; et al. | 2020-06-25 |
Deposition device structure
Grant 10,626,499 - Lo , et al. | 2020-04-21 |
Showerhead, semicondcutor processing apparatus having the same and semiconductor process
Grant 10,533,252 - Chiu , et al. Ja | 2020-01-14 |
Method For Controlling Plasma In Semiconductor Fabrication
App 20190378714 - WU; Cheng-Tsung ; et al. | 2019-12-12 |
Method and system for controlling plasma in semiconductor fabrication
Grant 10,395,918 - Wu , et al. A | 2019-08-27 |
Deposition Device Structure
App 20190032215 - LO; Yen-Chan ; et al. | 2019-01-31 |
Semiconductor structure with protection layer
Grant 10,164,063 - Chiang , et al. Dec | 2018-12-25 |
Thermal chemical vapor deposition system and operating method thereof
Grant 10,161,041 - Lo , et al. Dec | 2018-12-25 |
Thermal Chemical Vapor Deposition System and Operating Method Thereof
App 20180334747 - Lo; Yen-Chan ; et al. | 2018-11-22 |
Semiconductor Device Having a Shallow Trench Isolation Structure and Methods of Forming The Same
App 20180240698 - Lin; Chun-Li ; et al. | 2018-08-23 |
Semiconductor Structure With Protection Layer
App 20180166560 - CHIANG; Chih-Wei ; et al. | 2018-06-14 |
Semiconductor device having a shallow trench isolation structure and methods of forming the same
Grant 9,953,861 - Lin , et al. April 24, 2 | 2018-04-24 |
Gap fill self planarization on post EPI
Grant 9,831,307 - Chen , et al. November 28, 2 | 2017-11-28 |
Showerhead, Semicondcutor Processing Apparatus Having The Same And Semiconductor Process
App 20170283948 - Chiu; Chih-Chiang ; et al. | 2017-10-05 |
Interlayer dielectric structure with high aspect ratio process (HARP)
Grant 9,716,044 - Chang , et al. July 25, 2 | 2017-07-25 |
Coating Apparatus And Method Of Forming Coating Film
App 20170157625 - WANG; Lan-Hai ; et al. | 2017-06-08 |
Apparatus for dielectric deposition process
Grant 9,631,273 - Wang , et al. April 25, 2 | 2017-04-25 |
Thermal Chemical Vapor Deposition System And Operating Method Thereof
App 20170107619 - LO; Yen-Chan ; et al. | 2017-04-20 |
High density plasma reactor with multiple top coils
Grant 9,607,809 - Lo , et al. March 28, 2 | 2017-03-28 |
Gap Fill Self Planarization On Post Epi
App 20170084689 - Chen; Po-Chang ; et al. | 2017-03-23 |
Semiconductor Apparatus And Cleaning Method For The Semiconductor Apparatus
App 20170053783 - TSENG; Yin-Bin ; et al. | 2017-02-23 |
Coating apparatus and method of forming coating film
Grant 9,573,144 - Wang , et al. February 21, 2 | 2017-02-21 |
Gap fill self planarization on post EPI
Grant 9,536,771 - Chen , et al. January 3, 2 | 2017-01-03 |
Method And System For Controlling Plasma In Semiconductor Fabrication
App 20160343625 - WU; Cheng-Tsung ; et al. | 2016-11-24 |
Metal gate transistor and method for tuning metal gate profile
Grant 9,356,120 - Wu , et al. May 31, 2 | 2016-05-31 |
Semiconductor Device Having A Shallow Trench Isolation Structure And Methods Of Forming The Same
App 20160148833 - Lin; Chun-Li ; et al. | 2016-05-26 |
Thin film deposition apparatus with multi chamber design and film deposition methods
Grant 9,324,559 - Wang , et al. April 26, 2 | 2016-04-26 |
Semiconductor structure with anti-etch structure in via and method for manufacturing the same
Grant 9,209,071 - Chang , et al. December 8, 2 | 2015-12-08 |
Coating Apparatus And Method Of Forming Coating Film
App 20150348779 - WANG; Lan-Hai ; et al. | 2015-12-03 |
Semiconductor Structure With Anti-Etch Structure In Via And Method For Manufacturing The Same
App 20150279729 - Chang; Geng-Shuoh ; et al. | 2015-10-01 |
Metal Gate Transistor and Method for Tuning Metal Gate Profile
App 20150187939 - Wu; Po-Chi ; et al. | 2015-07-02 |
Profile pre-shaping for replacement poly gate interlayer dielectric
Grant 9,048,185 - Chiang , et al. June 2, 2 | 2015-06-02 |
Method of forming interlayer dielectric film above metal gate of semiconductor device
Grant 8,946,095 - Chen , et al. February 3, 2 | 2015-02-03 |
Pre-treatment Method For Metal-oxide Reduction And Device Formed
App 20150001728 - CHEN; Li ; et al. | 2015-01-01 |
Thin Film Deposition Apparatus With Multi Chamber Design And Film Deposition Methods
App 20140377961 - Wang; Lan Hai ; et al. | 2014-12-25 |
Profile Pre-shaping For Replacement Poly Gate Interlayer Dielectric
App 20140349471 - Chiang; Chih-Wei ; et al. | 2014-11-27 |
Gap Fill Self Planarization on Post EPI
App 20140306294 - Chen; Po-Chang ; et al. | 2014-10-16 |
High Density Plasma Reactor With Multiple Top Coils
App 20140273537 - LO; Chi-Ching ; et al. | 2014-09-18 |
Profile pre-shaping for replacement poly gate interlayer dielectric
Grant 8,803,249 - Chiang , et al. August 12, 2 | 2014-08-12 |
Method Of Forming Interlayer Dielectric Film Above Metal Gate Of Semiconductor Device
App 20140120706 - Chen; LI ; et al. | 2014-05-01 |
Profile Pre-shaping For Replacement Poly Gate Interlayer Dielectric
App 20140042553 - Chiang; Chih-Wei ; et al. | 2014-02-13 |
Apparatus for Dielectric Deposition Process
App 20140026813 - Wang; Lan-Hai ; et al. | 2014-01-30 |
Semiconductor Device And Method For Forming The Same
App 20130292791 - LIN; Chun-Li ; et al. | 2013-11-07 |
Interlayer Dielectric Structure And Method Making The Same
App 20130043539 - Chang; Jen-Chi ; et al. | 2013-02-21 |
Cap layer on doped dielectric
App 20070026653 - Leu; Po-Hsiung ; et al. | 2007-02-01 |
Inter-metal dielectric scheme for semiconductors
App 20060105558 - Chuang; Harry ; et al. | 2006-05-18 |
Robust fluorine containing Silica Glass (FSG) Film with less free fluorine
App 20060017166 - Leu; Po-Hsiung ; et al. | 2006-01-26 |
Solution for copper hillock induced by thermal strain with buffer zone for strain relaxation
Grant 6,897,147 - Tsai , et al. May 24, 2 | 2005-05-24 |
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