Leu; Fang-Jun
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leu; Fang-Jun.The latest application filed is for "electronic packaging structure".
- Leu; Fang-Jun - Hsinchu TW
- Leu; Fang-Jun - Taipei TW
- LEU; Fang-Jun - Taipei City TW
- Leu; Fang-Jun - Hsinchu City TW
| Patent | Date |
|---|---|
| Electronic packaging structure Grant 11,114,387 - Chang , et al. September 7, 2 | 2021-09-07 |
| Semiconductor package structure Grant 10,672,677 - Chang , et al. | 2020-06-02 |
| Electronic Packaging Structure App 20180358307 - Chang; Jing-Yao ; et al. | 2018-12-13 |
| Semiconductor Package Structure App 20180261519 - CHANG; Jing-Yao ; et al. | 2018-09-13 |
| Electronic Packaging Structure App 20180233477 - Chang; Jing-Yao ; et al. | 2018-08-16 |
| Semiconductor Package Structure App 20170084521 - CHANG; Jing-Yao ; et al. | 2017-03-23 |
| Packaging structure and method of an image sensor module Grant 7,572,676 - Leu , et al. August 11, 2 | 2009-08-11 |
| Image sensor packaging structure and method of manufacturing the same Grant 7,544,529 - Chen , et al. June 9, 2 | 2009-06-09 |
| Image sensor packaging structure Grant 7,417,293 - Chen , et al. August 26, 2 | 2008-08-26 |
| Packaging structure and method of an image sensor module Grant 7,411,306 - Leu , et al. August 12, 2 | 2008-08-12 |
| Packaging structure and method of an image sensor module App 20070195188 - Leu; Fang-Jun ; et al. | 2007-08-23 |
| Image Sensor Packaging Structure And Method Of Manufacturing The Same App 20070190687 - CHEN; Shou-Lung ; et al. | 2007-08-16 |
| Stacked package for electronic elements App 20060220212 - Chen; Shou-Lung ; et al. | 2006-10-05 |
| Stacked package for electronic elements and packaging method thereof Grant 7,091,592 - Chen , et al. August 15, 2 | 2006-08-15 |
| Packaging structure and method of an image sensor module App 20060030070 - Leu; Fang-Jun ; et al. | 2006-02-09 |
| Image sensor packaging structure and method of manufacturing the same App 20060022290 - Chen; Shou-Lung ; et al. | 2006-02-02 |
| Image sensor packaging structure and method App 20050236684 - Chen, Shou-Lung ; et al. | 2005-10-27 |
| Stacked package for electronic elements and packaging method thereof App 20040238933 - Chen, Shou-Lung ; et al. | 2004-12-02 |
| Fanless convection cooling design for personal computers Grant 5,243,493 - Jeng , et al. September 7, 1 | 1993-09-07 |
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