Letterman; James P.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Letterman; James P..The latest application filed is for "multi-chip semiconductor connector".
- Letterman; James P. - Mesa AZ
| Patent | Date |
|---|---|
| Multi-chip semiconductor connector Grant 8,253,239 - Carney , et al. August 28, 2 | 2012-08-28 |
| Multi-chip Semiconductor Connector App 20110068451 - Carney; Francis J. ; et al. | 2011-03-24 |
| Multi-chip semiconductor connector and method Grant 7,875,964 - Carney , et al. January 25, 2 | 2011-01-25 |
| Method of forming a leaded molded array package Grant 7,820,528 - Burghout , et al. October 26, 2 | 2010-10-26 |
| Method Of Forming A Leaded Molded Array Package App 20090298232 - Burghout; William F. ; et al. | 2009-12-03 |
| Semiconductor component and method of manufacture Grant 7,598,123 - Yoder , et al. October 6, 2 | 2009-10-06 |
| Method of forming a leaded molded array package Grant 7,588,999 - Burghout , et al. September 15, 2 | 2009-09-15 |
| Multi-chip semiconductor connector assemblies Grant 7,508,060 - Carney , et al. March 24, 2 | 2009-03-24 |
| Multi-chip semiconductor connector assembly method Grant 7,498,195 - Carney , et al. March 3, 2 | 2009-03-03 |
| Semiconductor Component And Method Of Manufacture App 20080217765 - Yoder; Jay A. ; et al. | 2008-09-11 |
| Encapsulated Chip Scale Package Having Flip-chip On Lead Frame Structure And Method App 20080197459 - Fauty; Joseph K. ; et al. | 2008-08-21 |
| Semiconductor Package And Method Therefor App 20080054424 - Celaya; Phillip ; et al. | 2008-03-06 |
| Multi-chip Semiconductor Connector Assemblies App 20080006920 - Carney; Francis J. ; et al. | 2008-01-10 |
| Multi-chip semiconductor connector assemblies Grant 7,298,034 - Carney , et al. November 20, 2 | 2007-11-20 |
| Multi-chip Semiconductor Connector Assembly Method App 20070126107 - Carney; Francis J. ; et al. | 2007-06-07 |
| Multi-chip Semiconductor Connector And Method App 20070126106 - Carney; Francis J. ; et al. | 2007-06-07 |
| Method of forming a leaded molded array package App 20070111393 - Burghout; William F. ; et al. | 2007-05-17 |
| Multi-chip semiconductor connector and method Grant 7,202,106 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector assembly method Grant 7,202,105 - Carney , et al. April 10, 2 | 2007-04-10 |
| Multi-chip semiconductor connector and method App 20050285235 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector assembly method App 20050287703 - Carney, Francis J. ; et al. | 2005-12-29 |
| Multi-chip semiconductor connector assemblies App 20050285249 - Carney, Francis J. ; et al. | 2005-12-29 |
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