Letourneau; Fabien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Letourneau; Fabien.The latest application filed is for "unit locking system and method".
- Letourneau; Fabien - Gatineau CA
- Letourneau; Fabien - Aylmer CA
| Patent | Date |
|---|---|
| Unit Locking System And Method App 20160223004 - Letourneau; Fabien | 2016-08-04 |
| Low Profile Standoff With Tool Stop App 20130259601 - Letourneau; Fabien | 2013-10-03 |
| Controlled flaring light transmission device Grant 8,534,892 - Letourneau , et al. September 17, 2 | 2013-09-17 |
| Controlled Flaring Light Transmission Device App 20120026750 - Letourneau; Fabien ; et al. | 2012-02-02 |
| Method of installing ventilating fans Grant 7,940,525 - Letourneau May 10, 2 | 2011-05-10 |
| High density component assembly method and apparatus Grant 7,797,823 - Letourneau , et al. September 21, 2 | 2010-09-21 |
| Method Of Installing Ventilating Fans App 20100107397 - Letourneau; Fabien | 2010-05-06 |
| Printed circuit board thickness adaptors Grant 7,663,888 - Creasy , et al. February 16, 2 | 2010-02-16 |
| High Density Component Assembly Method And Apparatus App 20090168348 - Letourneau; Fabien ; et al. | 2009-07-02 |
| Optimization of connector density and identification carrier for high density front plates App 20090097212 - Schmidt; Bevin ; et al. | 2009-04-16 |
| Printed circuit board thickness adaptors App 20080013290 - Creasy; Simon Paul ; et al. | 2008-01-17 |
| Ventilated housing and assembly App 20070264921 - Letourneau; Fabien ; et al. | 2007-11-15 |
| Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates Grant 7,057,904 - Bundza , et al. June 6, 2 | 2006-06-06 |
| Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates App 20050265010 - Bundza, Nicholas ; et al. | 2005-12-01 |
| Faceplate combination Grant 6,757,470 - Letourneau , et al. June 29, 2 | 2004-06-29 |
| Faceplate combination App 20030108320 - Letourneau, Fabien ; et al. | 2003-06-12 |
| Securing heat sinks to electronic components Grant 6,462,951 - Letourneau October 8, 2 | 2002-10-08 |
| Securing heat sinks to electronic components App 20010028552 - Letourneau, Fabien | 2001-10-11 |
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