Letize; Raymond A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Letize; Raymond A..The latest application filed is for "process for increasing the adhesion of a metal surface to a polymer".
- Letize; Raymond A. - West Haven CT
| Patent | Date |
|---|---|
| Process for increasing the adhesion of a metal surface to a polymer App 20080000552 - Letize; Raymond A. | 2008-01-03 |
| Method of stripping silver from a printed circuit board Grant 6,783,690 - Kologe , et al. August 31, 2 | 2004-08-31 |
| Method of stripping silver from a printed circuit board App 20030183598 - Kologe, Donna M. ; et al. | 2003-10-02 |
| Microetchant for copper surfaces and processes for using same Grant 5,328,561 - Letize , et al. July 12, 1 | 1994-07-12 |
| Method for improving insulation resistance of printed circuits Grant 4,978,422 - Letize , et al. December 18, 1 | 1990-12-18 |
| Electrolytic method for regenerating tin or tin-lead alloy stripping compositions Grant 4,944,851 - Cordani , et al. July 31, 1 | 1990-07-31 |
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