Letertre; Fabrice

Patent Applications and Registrations

Patent applications and USPTO patent grants for Letertre; Fabrice.The latest application filed is for "pseudo-substrate with improved efficiency of usage of single crystal material".

Company Profile

4.95.94

Letertre; Fabrice - Grenoble FR
Letertre; Fabrice - Meylan N/A FR
Letertre; Fabrice - Meyland FR
Letertre, Fabrice - Jongkind Grenoble

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pseudo-substrate With Improved Efficiency Of Usage Of Single Crystal Material App 20210050248 - Letertre; Fabrice ; et al.	2021-02-18
Pseudo-substrate with improved efficiency of usage of single crystal material Grant 10,910,256 - Letertre , et al. February 2, 2	2021-02-02
Integrated circuit formed from a stack of two series-connected chips Grant 10,672,746 - Lo Verde , et al.	2020-06-02
Integrated Circuit Formed From A Stack Of Two Series-connected Chips App 20190378823 - Lo Verde; Domenico ; et al.	2019-12-12
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 10,002,763 - Letertre , et al. June 19, 2	2018-06-19
Pseudo-substrate With Improved Efficiency Of Usage Of Single Crystal Material App 20150243549 - Letertre; Fabrice ; et al.	2015-08-27
Relaxation and transfer of strained material layers Grant 9,041,165 - Letertre , et al. May 26, 2	2015-05-26
Substrate cutting device and method Grant 8,991,673 - Rayssac , et al. March 31, 2	2015-03-31
Process for fabricating a semiconductor structure employing a temporary bond Grant 8,951,887 - Letertre , et al. February 10, 2	2015-02-10
Heterostructure for electronic power components, optoelectronic or photovoltaic components Grant 8,759,881 - Bethoux , et al. June 24, 2	2014-06-24
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,679,946 - Moriceau , et al. March 25, 2	2014-03-25
Strain engineered composite semiconductor substrates and methods of forming same Grant 8,679,942 - Letertre , et al. March 25, 2	2014-03-25
Optoelectronic substrate and methods of making same Grant 8,541,290 - Letertre , et al. September 24, 2	2013-09-24
Manufacturing Process For A Stacked Structure Comprising A Thin Layer Bonding To A Target Substrate App 20130230967 - Moriceau; Hubert ; et al.	2013-09-05
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 8,507,361 - Letertre , et al. August 13, 2	2013-08-13
Methods for relaxation and transfer of strained layers and structures fabricated thereby Grant 8,492,244 - Guenard , et al. July 23, 2	2013-07-23
Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same Grant 8,486,771 - Letertre , et al. July 16, 2	2013-07-16
Semiconductor structures and devices including semiconductor material on a non-glassy bonding layer Grant 8,487,295 - Letertre July 16, 2	2013-07-16
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Grant 8,481,409 - Moriceau , et al. July 9, 2	2013-07-09
Relaxation of strained layers Grant 8,481,408 - Letertre , et al. July 9, 2	2013-07-09
Methods of fabricating semiconductor structures and devices with strained semiconductor material Grant 8,461,014 - Letertre June 11, 2	2013-06-11
Process For Fabricating A Semiconductor Structure Employing A Temporary Bond App 20120329243 - Letertre; Fabrice ; et al.	2012-12-27
Heterostructure For Electronic Power Components, Optoelectronic Or Photovoltaic Components App 20120241821 - Bethoux; Jean-Marc ; et al.	2012-09-27
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 8,252,664 - Letertre , et al. August 28, 2	2012-08-28
Relaxation Of Strained Layers App 20120214291 - Letertre; Fabrice ; et al.	2012-08-23
Method of fabricating an epitaxially grown layer Grant 8,216,368 - Faure , et al. July 10, 2	2012-07-10
Semiconductor Structures And Devices Including Semiconductor Material On A Non-glassy Bonding Layer App 20120112205 - Letertre; Fabrice	2012-05-10
Methods Of Fabricating Semiconductor Structures And Devices With Strained Semiconductor Material App 20120100692 - Letertre; Fabrice	2012-04-26
Process for fabricating a structure for epitaxy without an exclusion zone Grant 8,154,022 - Arena , et al. April 10, 2	2012-04-10
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20120058621 - Letertre; Fabrice ; et al.	2012-03-08
Substrate Cutting Device And Method App 20120048906 - Rayssac; Olivier ; et al.	2012-03-01
Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods Grant 8,114,754 - Letertre February 14, 2	2012-02-14
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20120012048 - Letertre; Fabrice ; et al.	2012-01-19
Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer Grant 8,093,687 - Letertre , et al. January 10, 2	2012-01-10
Substrate cutting device and method Grant 8,083,115 - Rayssac , et al. December 27, 2	2011-12-27
Relaxation And Transfer Of Strained Material Layers App 20110291247 - Letertre; Fabrice ; et al.	2011-12-01
Methods and structures for relaxation of strained layers Grant 8,048,693 - Letertre , et al. November 1, 2	2011-11-01
Optoelectronic Substrate And Methods Of Making Same App 20110237008 - Letertre; Fabrice ; et al.	2011-09-29
Methods For Relaxation And Transfer Of Strained Layers And Structures Fabricated Thereby App 20110180911 - Guenard; Pascal ; et al.	2011-07-28
Methods for relaxation and transfer of strained layers and structures fabricated thereby Grant 7,981,767 - Guenard , et al. July 19, 2	2011-07-19
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20110171812 - Letertre; Fabrice ; et al.	2011-07-14
Transfer method with a treatment of a surface to be bonded Grant 7,972,939 - Kerdiles , et al. July 5, 2	2011-07-05
Relaxation Of Strained Layers App 20110143522 - Letertre; Fabrice ; et al.	2011-06-16
Heterostructure For Electronic Power Components, Optoelectronic Or Photovoltaic Components App 20110127581 - Bethoux; Jean-Marc ; et al.	2011-06-02
Methods Of Fabricating Semiconductor Structures And Devices Using Glass Bonding Layers, And Semiconductor Structures And Devices Formed By Such Methods App 20110114965 - Letertre; Fabrice	2011-05-19
Methods for making substrates and substrates formed therefrom Grant 7,939,428 - Boussagol , et al. May 10, 2	2011-05-10
Process for fabricating a structure for epitaxy without an exclusion zone Grant 7,902,045 - Arena , et al. March 8, 2	2011-03-08
Device and method for cutting an assembly Grant 7,892,946 - Rayssac , et al. February 22, 2	2011-02-22
Process For Fabricating A Structure For Epitaxy Without An Exclusion Zone App 20110037075 - Arena; Chantal ; et al.	2011-02-17
Methods For Making Substrates And Substrates Formed Therefrom App 20110039368 - Boussagol; Alice ; et al.	2011-02-17
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 7,888,235 - Letertre , et al. February 15, 2	2011-02-15
Multilayer structure and fabrication thereof Grant 7,863,650 - Letertre January 4, 2	2011-01-04
Methods for making substrates and substrates formed therefrom Grant 7,839,001 - Boussagol , et al. November 23, 2	2010-11-23
Semiconductor device with vertical electron injection and its manufacturing method Grant 7,820,461 - Baptist , et al. October 26, 2	2010-10-26
Methods Of Forming Relaxed Layers Of Semiconductor Materials, Semiconductor Structures, Devices And Engineered Substrates Including Same App 20100176490 - LETERTRE; Fabrice ; et al.	2010-07-15
Semiconductor substrates having useful and transfer layers Grant 7,741,678 - Ghyselen , et al. June 22, 2	2010-06-22
Strain Engineered Composite Semiconductor Substrates And Methods Of Forming Same App 20100127353 - LETERTRE; Fabrice ; et al.	2010-05-27
Methods And Structures For Relaxation Of Strained Layers App 20100032805 - LETERTRE; Fabrice ; et al.	2010-02-11
Methods For Relaxation And Transfer Of Strained Layers And Structures Fabricated Thereby App 20100032793 - Guenard; Pascal ; et al.	2010-02-11
Semiconductor substrates having useful and transfer layers Grant 7,655,537 - Ghyselen , et al. February 2, 2	2010-02-02
Transfer Method With A Treatment Of A Surface To Be Bonded App 20100015780 - KERDILES; Sebastien ; et al.	2010-01-21
Multilayer Structure And Fabrication Thereof App 20100006857 - Letertre; Fabrice	2010-01-14
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,645,684 - Letertre , et al. January 12, 2	2010-01-12
Method of fabricating heteroepitaxial microstructures Grant 7,646,038 - Faure , et al. January 12, 2	2010-01-12
Method Of Fabricating An Epitaxially Grown Layer App 20090321884 - Faure; Bruce ; et al.	2009-12-31
Methods For Making Substrates And Substrates Formed Therefrom App 20090289332 - Boussagol; Alice ; et al.	2009-11-26
Semiconductor substrates having useful and transfer layers Grant 7,622,330 - Ghyselen , et al. November 24, 2	2009-11-24
Methods for making substrates and substrates formed therefrom Grant 7,615,468 - Boussagol , et al. November 10, 2	2009-11-10
Transfer method with a treatment of a surface to be bonded Grant 7,615,464 - Kerdiles , et al. November 10, 2	2009-11-10
Multilayer structure and fabrication thereof Grant 7,611,974 - Letertre November 3, 2	2009-11-03
Method of fabricating an epitaxially grown layer Grant 7,601,217 - Faure , et al. October 13, 2	2009-10-13
Method of fabricating a semiconductor hetero-structure Grant 7,601,611 - Cayrefourcq , et al. October 13, 2	2009-10-13
Optoelectronic Substrate And Methods Of Making Same App 20090200569 - Letertre; Fabrice ; et al.	2009-08-13
Optoelectronic substrate and methods of making same Grant 7,537,949 - Letertre , et al. May 26, 2	2009-05-26
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,535,115 - Letertre , et al. May 19, 2	2009-05-19
Semiconductor substrates having useful and transfer layers Grant 7,465,991 - Ghyselen , et al. December 16, 2	2008-12-16
Process For Fabricating A Structure For Epitaxy Without An Exclusion Zone App 20080303118 - Arena; Chantal ; et al.	2008-12-11
Semiconductor Substrates Having Useful And Transfer Layers App 20080293185 - Ghyselen; Bruno ; et al.	2008-11-27
Semiconductor Substrates Having Useful And Transfer Layers App 20080293217 - Ghyselen; Bruno ; et al.	2008-11-27
Method of fabrication of highly heat dissipative substrates Grant 7,452,785 - Kononchuk , et al. November 18, 2	2008-11-18
Methods For Forming An Assembly For Transfer Of A Useful Layer App 20080258265 - Letertre; Fabrice ; et al.	2008-10-23
Wafer And Method Of Producing A Substrate By Transfer Of A Layer That Includes Foreign Species App 20080248631 - Letertre; Fabrice ; et al.	2008-10-09
Semiconductor Substrates Having Useful And Transfer Layers App 20080248251 - Ghyselen; Bruno ; et al.	2008-10-09
Method of fabricating a mixed substrate Grant 7,422,958 - Kostrzewa , et al. September 9, 2	2008-09-09
Semiconductor substrates having useful and transfer layers Grant 7,422,957 - Ghyselen , et al. September 9, 2	2008-09-09
Method Of Fabricating Heteroepitaxial Microstructures App 20080210975 - Faure; Bruce ; et al.	2008-09-04
Multilayer structure and fabrication thereof App 20080191239 - Letertre; Fabrice	2008-08-14
Method Of Fabrication Of Highly Heat Dissipative Substrates App 20080194084 - Kononchuk; Oleg ; et al.	2008-08-14
Method for manufacturing a free-standing substrate made of monocrystalline semiconductor material Grant 7,407,869 - Ghyselen , et al. August 5, 2	2008-08-05
Substrate for stressed systems and method of making same Grant 7,405,135 - Letertre , et al. July 29, 2	2008-07-29
Methods for forming an assembly for transfer of a useful layer Grant 7,404,870 - Letertre , et al. July 29, 2	2008-07-29
Method Of Fabricating A Mixed Substrate App 20080153251 - KOSTRZEWA; MAREK ; et al.	2008-06-26
Methods For Making Substrates And Substrates Formed Therefrom App 20070287273 - Boussagol; Alice ; et al.	2007-12-13
Fabrication Of Substrates With A Useful Layer Of Monocrystalline Semiconductor Material App 20070269960 - Letertre; Fabrice ; et al.	2007-11-22
Method of fabricating heteroepitaxial microstructures Grant 7,288,430 - Faure , et al. October 30, 2	2007-10-30
Substrate assembly for stressed systems Grant 7,279,779 - Letertre , et al. October 9, 2	2007-10-09
Fabrication of substrates with a useful layer of monocrystalline semiconductor material Grant 7,265,029 - Letertre , et al. September 4, 2	2007-09-04
Methods for transferring a useful layer of silicon carbide to a receiving substrate Grant 7,262,113 - Ghyselen , et al. August 28, 2	2007-08-28
Methods for preparing a semiconductor assembly Grant 7,256,101 - Letertre , et al. August 14, 2	2007-08-14
Device And Method For Cutting An Assembly App 20070148915 - Rayssac; Olivier ; et al.	2007-06-28
Methods for fabricating a substrate Grant 7,235,462 - Letertre , et al. June 26, 2	2007-06-26
Multifunctional metallic bonding Grant 7,232,739 - Kerdiles , et al. June 19, 2	2007-06-19
Device and method for cutting an assembly Grant 7,232,738 - Rayssac , et al. June 19, 2	2007-06-19
Methods for fabricating a germanium on insulator wafer Grant 7,229,898 - Bourdelle , et al. June 12, 2	2007-06-12
Substrate Cutting Device And Method App 20070119893 - Rayssac; Olivier ; et al.	2007-05-31
Semiconductor Device With Vertical Electron Injection And Its Manufacturing Method App 20070093009 - BAPTIST; Robert ; et al.	2007-04-26
Multifunctional metallic bonding Grant 7,189,632 - Kerdiles , et al. March 13, 2	2007-03-13
Substrate cutting device and method Grant 7,182,234 - Rayssac , et al. February 27, 2	2007-02-27
Substrate for stressed systems and method of making same Grant 7,163,873 - Letertre , et al. January 16, 2	2007-01-16
Substrate for stressed systems and method of making same Grant 7,145,214 - Letertre , et al. December 5, 2	2006-12-05
Transfer method with a treatment of a surface to be bonded App 20060270187 - Kerdiles; Sebastien ; et al.	2006-11-30
Methods for forming an assembly for transfer of a useful layer App 20060231203 - Letertre; Fabrice ; et al.	2006-10-19
Methods for forming an assembly for transfer of a useful layer Grant 7,122,095 - Letertre , et al. October 17, 2	2006-10-17
Multifunctional metallic bonding App 20060228820 - Kerdiles; Sebastien ; et al.	2006-10-12
Hybrid fully SOI-type multilayer structure App 20060220129 - Letertre; Fabrice ; et al.	2006-10-05
Substrate for stressed systems and method of making same App 20060216849 - Letertre; Fabrice ; et al.	2006-09-28
Method of fabricating a semiconductor hetero-structure App 20060216907 - Cayrefourcq; Ian ; et al.	2006-09-28
Substrate assembly for stressed systems App 20060192269 - Letertre; Fabrice ; et al.	2006-08-31
Semiconductor substrates having useful and transfer layers App 20060186397 - Ghyselen; Bruno ; et al.	2006-08-24
Semiconductor substrates having useful and transfer layers App 20060189095 - Ghyselen; Bruno ; et al.	2006-08-24
Optoelectronic substrate and methods of making same App 20060166390 - Letertre; Fabrice ; et al.	2006-07-27
Methods for fabricating final substrates Grant 7,071,029 - Ghyselen , et al. July 4, 2	2006-07-04
Substrate assembly for stressed systems Grant 7,067,393 - Letertre , et al. June 27, 2	2006-06-27
Method for the production of a composite sicoi-type substrate comprising an epitaxy stage App 20060125057 - Di Cioccio; Lea ; et al.	2006-06-15
Methods for fabricating a germanium on insulator wafer App 20060110899 - Bourdelle; Konstantin ; et al.	2006-05-25
Process for manufacturing a substrate and associated substrate Grant 7,041,577 - Rayssac , et al. May 9, 2	2006-05-09
Substrate for stressed systems and method of making same App 20060079070 - Letertre; Fabrice ; et al.	2006-04-13
Method of fabricating an epitaxially grown layer App 20060076559 - Faure; Bruce ; et al.	2006-04-13
Substrate for stressed systems and method of making same App 20060076649 - Letertre; Fabrice ; et al.	2006-04-13
Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate App 20060079071 - Moriceau; Hubert ; et al.	2006-04-13
Method for recycling a substrate Grant 7,022,586 - Maleville , et al. April 4, 2	2006-04-04
Wafer and method of producing a substrate by transfer of a layer that includes foreign species App 20060060922 - Letertre; Fabrice ; et al.	2006-03-23
Substrate for stressed systems and method of making same Grant 7,009,270 - Letertre , et al. March 7, 2	2006-03-07
Wafer and method of producing a substrate by transfer of a layer that includes foreign species Grant 7,008,859 - Letertre , et al. March 7, 2	2006-03-07
Method for manufacturing a free-standing substrate made of monocrystalline semiconductor material App 20060035440 - Ghyselen; Bruno ; et al.	2006-02-16
Method for transferring an electrically active thin layer App 20050282358 - Di Cioccio, Lea ; et al.	2005-12-22
Methods for transferring a useful layer of silicon carbide to a receiving substrate Grant 6,974,760 - Ghyselen , et al. December 13, 2	2005-12-13
Method for making a stacked comprising a thin film adhering to a target substrate Grant 6,974,759 - Moriceau , et al. December 13, 2	2005-12-13
Method of fabricating heteroepitaxial microstructures App 20050266626 - Faure, Bruce ; et al.	2005-12-01
Methods for transferring a useful layer of silicon carbide to a receiving substrate App 20050266659 - Ghyselen, Bruno ; et al.	2005-12-01
Quasi-vertical power semiconductor device on a composite substrate App 20050258483 - Templier, Francois ; et al.	2005-11-24
Method of manufacturing a free-standing substrate made of monocrystalline semi-conductor material Grant 6,964,914 - Ghyselen , et al. November 15, 2	2005-11-15
Method of fabricating heteroepitaxial microstructures Grant 6,946,317 - Faure , et al. September 20, 2	2005-09-20
Support-integrated donor wafers for repeated thin donor layer separation Grant 6,908,828 - Letertre , et al. June 21, 2	2005-06-21
Process for manufacturing a substrate and associated substrate App 20050112885 - Rayssac, Olivier ; et al.	2005-05-26
Methods for fabricating final substrates App 20050101105 - Ghyselen, Bruno ; et al.	2005-05-12
Methods for fabricating final substrates Grant 6,867,067 - Ghyselen , et al. March 15, 2	2005-03-15
Methods for adhesive transfer of a layer App 20050048736 - Kerdiles, Sebastien ; et al.	2005-03-03
Multifunctional metallic bonding App 20050048739 - Kerdiles, Sebastien ; et al.	2005-03-03
Method of fabricating substrates, in particular for optics, electronics or optoelectronics Grant 6,858,107 - Ghyselen , et al. February 22, 2	2005-02-22
Methods for transferring a useful layer of silicon carbide to a receiving substrate App 20050032330 - Ghyselen, Bruno ; et al.	2005-02-10
Methods for fabricating a substrate App 20050026394 - Letertre, Fabrice ; et al.	2005-02-03
Methods for preparing a semiconductor assembly App 20050020031 - Letertre, Fabrice ; et al.	2005-01-27
Device and method for cutting an assembly App 20050009297 - Rayssac, Olivier ; et al.	2005-01-13
Substrate assembly for stressed systems App 20050006740 - Letertre, Fabrice ; et al.	2005-01-13
Substrate cutting device and method App 20050000649 - Rayssac, Olivier ; et al.	2005-01-06
Method of fabricating heteroepitaxial microstructures App 20040241975 - Faure, Bruce ; et al.	2004-12-02
Substrate for stressed systems and method of making same App 20040241902 - Letertre, Fabrice ; et al.	2004-12-02
Support-integrated donor wafers for repeated thin donor layer separation App 20040241959 - Letertre, Fabrice ; et al.	2004-12-02
Fabrication of substrates with a useful layer of monocrystalline semiconductor material App 20040235268 - Letertre, Fabrice ; et al.	2004-11-25
Support-integrated donor wafers for repeated thin donor layer separation Grant 6,815,309 - Letertre , et al. November 9, 2	2004-11-09
Methods for forming an assembly for transfer of a useful layer App 20040206444 - Letertre, Fabrice ; et al.	2004-10-21
Method of fabricating monocrystalline crystals App 20040187766 - Letertre, Fabrice	2004-09-30
Methods for fabricating a substrate Grant 6,794,276 - Letertre , et al. September 21, 2	2004-09-21
Wafer and method of producing a substrate by transfer of a layer that includes foreign species App 20040121558 - Letertre, Fabrice ; et al.	2004-06-24
Method for recycling a substrate App 20040112866 - Maleville, Christophe ; et al.	2004-06-17
Method for providing a smooth wafer surface App 20040055998 - Letertre, Fabrice ; et al.	2004-03-25
Method of fabricating substrates, in partictular for optics, electronics or optoelectronics App 20040050483 - Ghyselen, Bruno ; et al.	2004-03-18
Methods for fabricating a substrate App 20040029359 - Letertre, Fabrice ; et al.	2004-02-12
Method for manufacturing a free-standing substrate made of monocrystalline semi-conductor material App 20040023468 - Ghyselen, Bruno ; et al.	2004-02-05
Method for making a stacked structure comprising a thin film adhering to a target substrate App 20040014299 - Moriceau, Hubert ; et al.	2004-01-22
Fabrication of substrates with a useful layer of monocrystalline semiconductor material App 20030232487 - Letertre, Fabrice ; et al.	2003-12-18
Methods for fabricating final substrates App 20030219959 - Ghyselen, Bruno ; et al.	2003-11-27
Support-integrated donor wafers for repeated thin donor layer separation App 20030153163 - Letertre, Fabrice ; et al.	2003-08-14
Semiconductor device with vertical electron injection and method for making same App 20030116791 - Baptist, Robert ; et al.	2003-06-26

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