LER; Hui Min
Patent Applications and Registrations
Patent applications and USPTO patent grants for LER; Hui Min.The latest application filed is for "semiconductor package with wettable flank and related methods".
- LER; Hui Min - Seremban MY
| Patent | Date |
|---|---|
| Semiconductor Package With Wettable Flank And Related Methods App 20220208658 - LER; Hui Min ; et al. | 2022-06-30 |
| Semiconductor Devices And Methods Of Making The Same App 20200312749 - KHOR; Swee Har ; et al. | 2020-10-01 |
| Semiconductor devices and methods of making the same Grant 10,727,170 - Khor , et al. | 2020-07-28 |
| Long-lasting Wettable Flanks App 20180090421 - THEN; Nam Khong ; et al. | 2018-03-29 |
| Semiconductor Devices And Methods Of Making The Same App 20170062310 - KHOR; Swee Har ; et al. | 2017-03-02 |
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