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Patent applications and USPTO patent grants for LePere, Pierre H..The latest application filed is for "heat-relaxable substrates and arrays".
Patent | Date |
---|---|
Heat-relaxable substrates and arrays App 20030036090 - Patil, Sanjay L. ;   et al. | 2003-02-20 |
Method of imaging an article Grant 6,180,318 - Fitzer , et al. January 30, 2 | 2001-01-30 |
Microwave heatable composites Grant 5,446,270 - Chamberlain , et al. August 29, 1 | 1995-08-29 |
Microwave-active tape having a cured polyolefin pressure-sensitive adhesive layer Grant 5,428,209 - Babu , et al. * June 27, 1 | 1995-06-27 |
Configured microwave susceptor Grant 5,310,977 - Stenkamp , et al. May 10, 1 | 1994-05-10 |
Microwave-active tape having a cured polyolefin pressure-sensitive adhesive layer Grant 5,298,708 - Babu , et al. March 29, 1 | 1994-03-29 |
Microwave heatable composites Grant 5,294,763 - Chamberlain , et al. March 15, 1 | 1994-03-15 |
Tamper evident top tab innerseal Grant 5,265,745 - Pereyra , et al. November 30, 1 | 1993-11-30 |
Microwave food package Grant 5,241,150 - Garvey , et al. August 31, 1 | 1993-08-31 |
Microwave food package and grease absorbent pad therefor Grant 5,041,325 - Larson , et al. August 20, 1 | 1991-08-20 |
Microwave absorbing composite Grant 4,962,000 - Emslander , et al. October 9, 1 | 1990-10-09 |
Microwave food package and grease absorbent pad therefor Grant 4,873,101 - Larson , et al. October 10, 1 | 1989-10-10 |
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