loadpatents
name:-0.008897066116333
name:-0.0044498443603516
name:-0.0017671585083008
Leong; Yew Wei Patent Filings

Leong; Yew Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leong; Yew Wei.The latest application filed is for "electroless nickel plating of silicone rubber".

Company Profile
1.3.7
  • Leong; Yew Wei - Singapore SG
  • Leong; Yew Wei - Kyoto-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Electroless Nickel Plating Of Silicone Rubber
App 20210262095 - Wang; Shengqin ;   et al.
2021-08-26
Near infrared reflective coating composition, coating and methods of forming the same
Grant 11,059,979 - Pan , et al. July 13, 2
2021-07-13
Electroless nickel plating of silicone rubber
Grant 11,028,484 - Wang , et al. June 8, 2
2021-06-08
Electroless Nickel Plating Of Silicone Rubber
App 20190352779 - Wang; Shengqin ;   et al.
2019-11-21
Near Infrared Reflective Coating Composition, Coating And Methods Of Forming The Same
App 20180086920 - Pan; Yongzheng ;   et al.
2018-03-29
A Composite Laminate And Its Usage
App 20180029326 - LEONG; Yew Wei ;   et al.
2018-02-01
Composite Foam Laminate And Its Usage
App 20150064397 - Leong; Yew Wei ;   et al.
2015-03-05
Hybrid polymers
Grant 8,853,330 - Leong , et al. October 7, 2
2014-10-07
Hybrid Polymers
App 20140046005 - LEONG; Yew Wei ;   et al.
2014-02-13
Composite Molded Article Having Two-layer Structure
App 20110250456 - Okamura; Akira ;   et al.
2011-10-13

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