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Patent applications and USPTO patent grants for Leong; Yew Wei.The latest application filed is for "electroless nickel plating of silicone rubber".
Patent | Date |
---|---|
Electroless Nickel Plating Of Silicone Rubber App 20210262095 - Wang; Shengqin ;   et al. | 2021-08-26 |
Near infrared reflective coating composition, coating and methods of forming the same Grant 11,059,979 - Pan , et al. July 13, 2 | 2021-07-13 |
Electroless nickel plating of silicone rubber Grant 11,028,484 - Wang , et al. June 8, 2 | 2021-06-08 |
Electroless Nickel Plating Of Silicone Rubber App 20190352779 - Wang; Shengqin ;   et al. | 2019-11-21 |
Near Infrared Reflective Coating Composition, Coating And Methods Of Forming The Same App 20180086920 - Pan; Yongzheng ;   et al. | 2018-03-29 |
A Composite Laminate And Its Usage App 20180029326 - LEONG; Yew Wei ;   et al. | 2018-02-01 |
Composite Foam Laminate And Its Usage App 20150064397 - Leong; Yew Wei ;   et al. | 2015-03-05 |
Hybrid polymers Grant 8,853,330 - Leong , et al. October 7, 2 | 2014-10-07 |
Hybrid Polymers App 20140046005 - LEONG; Yew Wei ;   et al. | 2014-02-13 |
Composite Molded Article Having Two-layer Structure App 20110250456 - Okamura; Akira ;   et al. | 2011-10-13 |
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