loadpatents
name:-0.0085880756378174
name:-0.0047721862792969
name:-0.0058059692382812
Lentz; Daniel M. Patent Filings

Lentz; Daniel M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lentz; Daniel M..The latest application filed is for "printing patterns via die cutting".

Company Profile
5.4.9
  • Lentz; Daniel M. - Cottage Grove MN
  • Lentz; Daniel M. - Woodbury MN
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Nonplanar patterned nanostructured surface and printing methods for making thereof
Grant 11,446,918 - Zhu , et al. September 20, 2
2022-09-20
Printing Patterns Via Die Cutting
App 20220048286 - Metzler; Thomas J. ;   et al.
2022-02-17
Nonplanar Patterned Nanostructured Surface And Printing Methods For Making Thereof
App 20210260901 - Zhu; James ;   et al.
2021-08-26
Nonplanar Patterned Nanostructured Surface And Printing Methods For Making Thereof
App 20210094272 - Zhu; James ;   et al.
2021-04-01
Nonplanar Patterned Nanostructured Surface And Printing Methods For Making Thereof
App 20210008866 - Zhu; James ;   et al.
2021-01-14
Method of making a nanostructured cylindrical roll
Grant 10,838,297 - Zhu , et al. November 17, 2
2020-11-17
Retroreflective Article Comprising Embedded Reflective Layers
App 20200264349 - Chen-Ho; Kui ;   et al.
2020-08-20
Method Of Making A Nanostructured Cylindrical Roll
App 20190219919 - Zhu; James ;   et al.
2019-07-18
Microcontact printing stamps with functional features
Grant 9,873,276 - Tarnowski , et al. January 23, 2
2018-01-23
Microcontact Printing Stamps With Functional Features
App 20160250875 - Tarnowski; Catherine P. ;   et al.
2016-09-01
Methods of continuously wet etching a patterned substrate
Grant 9,301,397 - Tokie , et al. March 29, 2
2016-03-29
Methods of Continuously Wet Etching A Patterned Substrate
App 20140231381 - Tokie; Jeffrey H. ;   et al.
2014-08-21
A Process For Incorporating An Interpenetrating Network Or Blend Into The Surface Layer Of A Polymeric Article
App 20120077038 - Pyles; Robert A. ;   et al.
2012-03-29

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