Leng; Ser Bok
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leng; Ser Bok.The latest application filed is for "apparatus and method for packaging circuits".
- Leng; Ser Bok - Singapore SG
| Patent | Date |
|---|---|
| Packaged microelectronic components with terminals exposed through encapsulant Grant 8,637,973 - Koon , et al. January 28, 2 | 2014-01-28 |
| Apparatus and method for packaging circuits Grant 8,138,617 - Poo , et al. March 20, 2 | 2012-03-20 |
| Apparatus and method for packaging circuits Grant 8,115,306 - Poo , et al. February 14, 2 | 2012-02-14 |
| Apparatus And Method For Packaging Circuits App 20100140794 - Poo; Chia Yong ; et al. | 2010-06-10 |
| Apparatus and method for packaging circuits Grant 7,675,169 - Poo , et al. March 9, 2 | 2010-03-09 |
| Method for fabricating packaged die Grant 7,358,154 - Poo , et al. April 15, 2 | 2008-04-15 |
| Packaged Microelectronic Components App 20080067642 - Koon; Eng Meow ; et al. | 2008-03-20 |
| Apparatus And Method For Packaging Circuits App 20080054423 - Poo; Chia Y. ; et al. | 2008-03-06 |
| Semiconductor packages having leadframe-based connection arrays App 20070120247 - Yu; Chan Min ; et al. | 2007-05-31 |
| Packaged microelectronic components Grant 7,195,957 - Koon , et al. March 27, 2 | 2007-03-27 |
| In-process semiconductor packages with leadframe grid arrays Grant 7,170,161 - Yu , et al. January 30, 2 | 2007-01-30 |
| Apparatus and method for packaging circuits App 20060084240 - Poo; Chia Yong ; et al. | 2006-04-20 |
| Methods for making semiconductor packages with leadframe grid arrays Grant 6,967,127 - Yu , et al. November 22, 2 | 2005-11-22 |
| Methods for making semiconductor packages with leadframe grid arrays App 20050230808 - Yu, Chan Min ; et al. | 2005-10-20 |
| Apparatus and method for packaging circuits Grant 6,894,386 - Poo , et al. May 17, 2 | 2005-05-17 |
| Apparatus and method for packaging circuits App 20050029668 - Poo, Chia Yong ; et al. | 2005-02-10 |
| Packaged microelectronic components App 20050026325 - Koon, Eng Meow ; et al. | 2005-02-03 |
| Semiconductor packages with leadframe grid arrays and components Grant 6,836,008 - Yu , et al. December 28, 2 | 2004-12-28 |
| Packaged microelectronic components Grant 6,836,009 - Koon , et al. December 28, 2 | 2004-12-28 |
| Packaged microelectronic components App 20040026773 - Koon, Eng Meow ; et al. | 2004-02-12 |
| Methods for making semiconductor packages with leadframe grid arrays App 20030194837 - Yu, Chan Min ; et al. | 2003-10-16 |
| Semiconductor packages with leadframe grid arrays and components and methods for making the same App 20030193091 - Yu, Chan Min ; et al. | 2003-10-16 |
| Apparatus and method for packaging circuits App 20030067001 - Poo, Chin Yong ; et al. | 2003-04-10 |
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