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Patent applications and USPTO patent grants for Lender, Jr.; Robert J..The latest application filed is for "method and design of an rf thru-via interconnect".
Patent | Date |
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High power radio frequency amplifier architecture Grant 9,742,445 - Actis , et al. August 22, 2 | 2017-08-22 |
Ultra-wideband high-power solid-state transmitter for electronic warfare applications Grant 9,537,605 - Actis , et al. January 3, 2 | 2017-01-03 |
Low voltage high efficiency gallium arsenide power amplifier Grant 9,083,291 - Lender, Jr. , et al. July 14, 2 | 2015-07-14 |
Method and design of an RF thru-via interconnect Grant 9,024,326 - Actis , et al. May 5, 2 | 2015-05-05 |
Ultra-wideband high power amplifier architecture Grant 8,989,683 - Actis , et al. March 24, 2 | 2015-03-24 |
High power amplifier Grant 8,669,812 - Actis , et al. March 11, 2 | 2014-03-11 |
Method And Design Of An Rf Thru-via Interconnect App 20130341644 - Actis; Robert ;   et al. | 2013-12-26 |
Low Voltage High Efficiency Gallium Arsenide Power Amplifier App 20130321087 - Lender, JR.; Robert J. ;   et al. | 2013-12-05 |
Broadband high power amplifier Grant 8,576,009 - Lender, Jr. , et al. November 5, 2 | 2013-11-05 |
Ultra-wideband High Power Amplifier Architecture App 20130260703 - Actis; Robert ;   et al. | 2013-10-03 |
High Power Amplifier App 20120268213 - Actis; Robert ;   et al. | 2012-10-25 |
Broadband High Power Amplifier App 20120081182 - Lender, JR.; Robert J. ;   et al. | 2012-04-05 |
Broadband high power amplifier Grant 8,076,975 - Lender, Jr. , et al. December 13, 2 | 2011-12-13 |
Solid-state ultra-wideband microwave power amplifier employing modular non-uniform distributed amplifier elements Grant 7,924,097 - Lender, Jr. , et al. April 12, 2 | 2011-04-12 |
Solid-state ultra-wideband microwave power amplifier employing modular non-uniform distributed amplifier elements App 20090309659 - Lender, JR.; Robert J. ;   et al. | 2009-12-17 |
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