Len; Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Len; Michael.The latest application filed is for "near-hermetic package with flexible signal input and output".

Company Profile

2.2.7

Len; Michael - Santa Ana CA
Len; Michael - Skaneateles NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Near-hermetic Package With Flexible Signal Input And Output App 20220248553 - Len; Michael ; et al.	2022-08-04
High Powered Rf Part For Improved Manufacturability App 20220247058 - Len; Michael ; et al.	2022-08-04
Devices And Methods For Forming Engineered Thermal Paths Of Printed Circuit Boards By Use Of Removable Layers App 20220183141 - Neely; Matthew D. ; et al.	2022-06-09
High Powered Rf Part For Improved Manufacturability App 20220029262 - Len; Michael ; et al.	2022-01-27
High powered RF part for improved manufacturability Grant 11,158,920 - Len , et al. October 26, 2	2021-10-26
Methods For Fabricating Printed Circuit Board Assemblies With High Density Via Array App 20210227695 - LEN; Michael ; et al.	2021-07-22
Methods for fabricating printed circuit board assemblies with high density via array Grant 10,980,127 - Len , et al. April 13, 2	2021-04-13
Methods For Fabricating Printed Circuit Board Assemblies With High Density Via Array App 20200288576 - LEN; Michael ; et al.	2020-09-10
High Powered Rf Part For Improved Manufacturability App 20170309983 - Len; Michael ; et al.	2017-10-26

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