Leicht; John L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Leicht; John L..The latest application filed is for "alloy solder connect assembly and method of connection".
- Leicht; John L. - Hawthorn Woods IL
| Patent | Date |
|---|---|
| Alloy solder connect assembly and method of connection Grant 5,551,627 - Leicht , et al. September 3, 1 | 1996-09-03 |
| Welding design for plated, dissimilar metals Grant 5,136,135 - Bratschun , et al. August 4, 1 | 1992-08-04 |
| Three-dimensional microwave circuit carrier and integral waveguide coupler Grant 5,045,820 - Leicht , et al. September 3, 1 | 1991-09-03 |
| Circuit location sensor for component placement apparatus Grant 4,876,656 - Leicht , et al. October 24, 1 | 1989-10-24 |
| Apparatus for dispensing solder paste Grant 4,693,209 - Leicht September 15, 1 | 1987-09-15 |
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