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name:-0.0043749809265137
name:-0.014017105102539
name:-0.00043797492980957
Leibovitz; Jacques Patent Filings

Leibovitz; Jacques

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leibovitz; Jacques.The latest application filed is for "method and structure for uniform height solder bumps on a semiconductor wafer".

Company Profile
0.12.0
  • Leibovitz; Jacques - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method and structure for uniform height solder bumps on a semiconductor wafer
Grant 6,268,656 - Leibovitz , et al. July 31, 2
2001-07-31
Method and structure for uniform height solder bumps on a semiconductor wafer
Grant 6,146,984 - Leibovitz , et al. November 14, 2
2000-11-14
Redistribution layer and under bump material structure for converting periphery conductive pads to an array of solder bumps
Grant 6,011,314 - Leibovitz , et al. January 4, 2
2000-01-04
Low cost, high thermal performance package for flip chips with low mechanical stress on chip
Grant 5,621,615 - Dawson, deceased , et al. April 15, 1
1997-04-15
Reliable low thermal resistance package for high power flip clip ICs
Grant 5,585,671 - Nagesh , et al. December 17, 1
1996-12-17
Reworkable die attachment
Grant 5,268,048 - Leibovitz , et al. December 7, 1
1993-12-07
Heat pipe-electrical interconnect integration method for chip modules
Grant 5,199,165 - Crawford , et al. April 6, 1
1993-04-06
Stacked solid via formation in integrated circuit systems
Grant 5,162,260 - Leibovitz , et al. November 10, 1
1992-11-10
Heat pipe-electrical interconnect integration for chip modules
Grant 5,161,090 - Crawford , et al. November 3, 1
1992-11-03
Stacked solid via formation in integrated circuit systems
Grant 5,055,425 - Leibovitz , et al. October 8, 1
1991-10-08
Hierarchical tape automated bonding method
Grant 5,029,386 - Chao , et al. July 9, 1
1991-07-09
Process using supercritical conditions for producing highly accurate and homogeneous powder mixture useful in fabrication of high quality ceramic superconductors
Grant 5,011,819 - Leibovitz April 30, 1
1991-04-30

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