loadpatents
name:-0.019798994064331
name:-0.015169858932495
name:-0.0082719326019287
Leib; Jeffrey S. Patent Filings

Leib; Jeffrey S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Leib; Jeffrey S..The latest application filed is for "fabrication of gate-all-around integrated circuit structures having molybdenum nitride metal gates and gate dielectrics with a dipole layer".

Company Profile
24.17.23
  • Leib; Jeffrey S. - Beaverton OR
  • Leib; Jeffrey S. - Hillsboro OR
  • Leib; Jeffrey S - Hillsboro OR
  • LEIB; Jeffrey S. - Hillsbore OR US
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication
Grant 11,342,445 - Leib , et al. May 24, 2
2022-05-24
Fabrication Of Gate-all-around Integrated Circuit Structures Having Molybdenum Nitride Metal Gates And Gate Dielectrics With A Dipole Layer
App 20220093597 - OUELLETTE; Daniel G. ;   et al.
2022-03-24
Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication
App 20210249524 - JOSHI; Subhash M. ;   et al.
2021-08-12
Trench contact structures for advanced integrated circuit structure fabrication
Grant 11,088,261 - Joshi , et al. August 10, 2
2021-08-10
Metal chemical vapor deposition approaches for fabricating wrap-around contacts and resulting structures
Grant 11,063,151 - Leib , et al. July 13, 2
2021-07-13
Metallization in integrated circuit structures
Grant 11,018,222 - O'Brien , et al. May 25, 2
2021-05-25
Replacement Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20210091206 - HO; Byron ;   et al.
2021-03-25
Trench contact structures for advanced integrated circuit structure fabrication
Grant 10,957,782 - Joshi , et al. March 23, 2
2021-03-23
Dual Metal Silicide Structures For Advanced Integrated Circuit Structure Fabrication
App 20210043520 - LEIB; Jeffrey S. ;   et al.
2021-02-11
Dual Metal Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20210043754 - LEIB; Jeffrey S. ;   et al.
2021-02-11
Replacement gate structures for advanced integrated circuit structure fabrication
Grant 10,886,383 - Ho , et al. January 5, 2
2021-01-05
Replacement Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20200388697 - HO; Byron ;   et al.
2020-12-10
Dual metal gate structures for advanced integrated circuit structure fabrication
Grant 10,854,732 - Leib , et al. December 1, 2
2020-12-01
Dual metal silicide structures for advanced integrated circuit structure fabrication
Grant 10,840,151 - Leib , et al. November 17, 2
2020-11-17
Differentiated Voltage Threshold Metal Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20200335603 - LEIB; Jeffrey S. ;   et al.
2020-10-22
Dual Metal Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20200321449 - LEIB; Jeffrey S. ;   et al.
2020-10-08
Dual metal silicide structures for advanced integrated circuit structure fabrication
Grant 10,796,968 - Leib , et al. October 6, 2
2020-10-06
Replacement gate structures for advanced integrated circuit structure fabrication
Grant 10,790,378 - Ho , et al. September 29, 2
2020-09-29
Differentiated voltage threshold metal gate structures for advanced integrated circuit structure fabrication
Grant 10,741,669 - Leib , et al. A
2020-08-11
Dual metal gate structures for advanced integrated circuit structure fabrication
Grant 10,727,313 - Leib , et al.
2020-07-28
Microelectronic Devices And Methods For Enhancing Interconnect Reliability Performance Using Tungsten Containing Adhesion Layers
App 20200066645 - FARMER; Jason A. ;   et al.
2020-02-27
Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication
App 20200027965 - JOSHI; Subhash M. ;   et al.
2020-01-23
Dual Metal Silicide Structures For Advanced Integrated Circuit Structure Fabrication
App 20200013680 - LEIB; Jeffrey S. ;   et al.
2020-01-09
Metal Chemical Vapor Deposition Approaches For Fabricating Wrap-around Contacts And Resulting Structures
App 20190393336 - LEIB; Jeffrey S. ;   et al.
2019-12-26
Replacement Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20190165146 - HO; Byron ;   et al.
2019-05-30
Trench Contact Structures For Advanced Integrated Circuit Structure Fabrication
App 20190165136 - JOSHI; Subhash M. ;   et al.
2019-05-30
Dual Metal Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20190164969 - LEIB; Jeffrey S. ;   et al.
2019-05-30
Differentiated Voltage Threshold Metal Gate Structures For Advanced Integrated Circuit Structure Fabrication
App 20190164968 - LEIB; Jeffrey S. ;   et al.
2019-05-30
Dual Metal Silicide Structures For Advanced Integrated Circuit Structure Fabrication
App 20190164846 - LEIB; Jeffrey S. ;   et al.
2019-05-30
Method of forming a wrap-around contact on a semiconductor device
Grant 10,297,499 - Leib , et al.
2019-05-21
Replacement gate structures for advanced integrated circuit structure fabrication
Grant 10,121,875 - Ho , et al. November 6, 2
2018-11-06
Direct plasma densification process and semiconductor devices
Grant 10,096,513 - Farmer , et al. October 9, 2
2018-10-09
Method Of Forming A Wrap-around Contact On A Semiconductor Device
App 20170309516 - Leib; Jeffrey S. ;   et al.
2017-10-26
Direct Plasma Densification Process And Semiconductor Devices
App 20170278748 - FARMER; JASON A. ;   et al.
2017-09-28
Direct plasma densification process and semiconductor devices
Grant 9,711,399 - Farmer , et al. July 18, 2
2017-07-18
Method of forming a wrap-around contact on a semiconductor device
Grant 9,704,744 - Leib , et al. July 11, 2
2017-07-11
Direct Plasma Densification Process And Semiconductor Devices
App 20160307797 - FARMER; JASON A. ;   et al.
2016-10-20
Method Of Forming A Wrap-around Contact On A Semiconductor Device
App 20160254186 - LEIB; JEFFREY S ;   et al.
2016-09-01

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